Amitec- Advanced Multilayer Interconnect Technologies LTD

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Migdal HaEmek, IL

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Patents Grantslast 30 patents

Information Patent Grant
Coreless cavity substrates for chip packaging and their fabrication
- Patent number 7,669,320
- Issue date Mar 2, 2010
- Amitec-Advanced Multilayer Interconnect Technologies Ltd.
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit support structures and their fabrication
- Patent number 7,635,641
- Issue date Dec 22, 2009
- Amitec-Advanced Multilayer Interconnect Technologies Ltd.
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a chip carrier substrate
- Patent number 6,280,640
- Issue date Aug 28, 2001
- Amitec-Advanced Multilayer Interconnect Technologies Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic interconnect structure and method for manufacturing it
- Patent number 6,262,478
- Issue date Jul 17, 2001
- Amitec-Advanced Multilayer Interconnect Technologies Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
CORELESS CAVITY SUBSTRATES FOR CHIP PACKAGING AND THEIR FABRICATION
- Publication number 20070289127
- Publication date Dec 20, 2007
- Amitec- Advanced Multilayer Interconnect Technologies LTD
- Dror HURWITZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR