AMKOR TECHNOLOGY KOREA, INC

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GWANGJU, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip testing apparatus for picking up and testing a s...
- Patent number 9,664,706
- Issue date May 30, 2017
- SEMICORE INC.
- Duk-Soon Choi
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating a semiconductor device having an interposer
- Patent number 8,802,494
- Issue date Aug 12, 2014
- Amkor Technology Korea, Inc.
- Choon Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable wafer level package and fabricating method thereof
- Patent number 8,446,017
- Issue date May 21, 2013
- Amkor Technology Korea, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an interposer
- Patent number 8,183,678
- Issue date May 22, 2012
- Amkor Technology Korea, Inc.
- Choon Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board for semiconductor package
- Patent number 6,469,258
- Issue date Oct 22, 2002
- Amkor Technology, Inc.
- Choon Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210005563
- Publication date Jan 7, 2021
- Amkor Technology Korea, Inc.
- Yeong Beom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200402885
- Publication date Dec 24, 2020
- Amkor Technology Korea, Inc.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200399119
- Publication date Dec 24, 2020
- Amkor Technology Korea, Inc.
- Ki Yeul YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200373247
- Publication date Nov 26, 2020
- Amkor Technology Korea, Inc.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20200176345
- Publication date Jun 4, 2020
- Amkor Technology Korea, Inc.
- Se Man Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP TESTING APPARATUS
- Publication number 20160154023
- Publication date Jun 2, 2016
- Amkor Technology Korea, Inc.
- Duk-Soon CHOI
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING AN INTERPOSER
- Publication number 20130109135
- Publication date May 2, 2013
- AMKOR Technology Korea, Inc.
- Choon Heung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20110031598
- Publication date Feb 10, 2011
- AMKOR Technology Korea, Inc.
- Choon Heung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Colored conductive wires for a semiconductor package
- Publication number 20050156327
- Publication date Jul 21, 2005
- Amkor Technology, Inc.
- Sang Hyun Ryu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

AMKOR TECHNOLOGY KOREA, INC

Organization

Patents Grantslast 30 patents

Semiconductor chip testing apparatus for picking up and testing a s...

Method of fabricating a semiconductor device having an interposer

Stackable wafer level package and fabricating method thereof

Semiconductor device having an interposer

Circuit board for semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR CHIP TESTING APPARATUS

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING AN INTERPOSER

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Colored conductive wires for a semiconductor package