AP Memory Technology (Hangzhou) Limited Co.

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Hangzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Circuit assembly
- Patent number 12,074,103
- Issue date Aug 27, 2024
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of operating microelectronic package
- Patent number 11,887,974
- Issue date Jan 30, 2024
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of correcting duty cycle
- Patent number 11,757,432
- Issue date Sep 12, 2023
- AP Memory Technology (Hangzhou) Limited Co.
- Xuan Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method to manufacture semiconductor device
- Patent number 11,652,011
- Issue date May 16, 2023
- AP Memory Technology Corp.
- Wen Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly
- Patent number 11,380,614
- Issue date Jul 5, 2022
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling microelectronic package and method of operatin...
- Patent number 11,315,916
- Issue date Apr 26, 2022
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell, memory device, and related identification tag
- Patent number 11,250,922
- Issue date Feb 15, 2022
- AP Memory Technology Corp.
- Owen Yuwen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method to manufacture the same
- Patent number 11,158,552
- Issue date Oct 26, 2021
- AP Memory Technology Corp.
- Wen Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor device and manufacturing method therefor
- Patent number 11,038,012
- Issue date Jun 15, 2021
- AP Memory Technology Corp.
- Masaru Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit system having compact decoupling structure
- Patent number 10,978,413
- Issue date Apr 13, 2021
- AP MEMORY TECHNOLOGY CORP.
- Masaru Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and microelectronic package having the same
- Patent number 10,811,402
- Issue date Oct 20, 2020
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20240371747
- Publication date Nov 7, 2024
- AP Memory Technology Corp.
- Wenliang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20220302021
- Publication date Sep 22, 2022
- AP Memory Technology Corp.
- Wenliang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF CORRECTING DUTY CYCLE
- Publication number 20220302905
- Publication date Sep 22, 2022
- AP Memory Technology (Hangzhou) Limited Co.
- Xuan ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF OPERATING MICROELECTRONIC PACKAGE
- Publication number 20220157800
- Publication date May 19, 2022
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO MANUFACTURE SEMICONDUCTOR DEVICE
- Publication number 20210375705
- Publication date Dec 2, 2021
- AP Memory Technology Corp.
- Wen Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, MEMORY DEVICE, AND RELATED IDENTIFICATION TAG
- Publication number 20210327521
- Publication date Oct 21, 2021
- AP Memory Technology Corp.
- Owen Yuwen LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20210050410
- Publication date Feb 18, 2021
- AP Memory Technology Corp.
- Masaru HARAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING MICROELECTRONIC PACKAGE AND METHOD OF OPERATIN...
- Publication number 20200411497
- Publication date Dec 31, 2020
- AP Memory Technology Corp.
- WENLIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20200402903
- Publication date Dec 24, 2020
- AP Memory Technology Corp.
- Wenliang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INCLUDING NEURAL NETWORK PROCESSORS AND METHODS FOR MANUFACTUR...
- Publication number 20200364547
- Publication date Nov 19, 2020
- ICLEAGUE Technology Co., Ltd.
- Wenliang CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD TO MANUFACTURE THE SAME
- Publication number 20200357709
- Publication date Nov 12, 2020
- AP Memory Technology Corp.
- Wen Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MICROELECTRONIC PACKAGE HAVING THE SAME
- Publication number 20200212027
- Publication date Jul 2, 2020
- AP Memory Technology Corp.
- WENLIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE
- Publication number 20200105688
- Publication date Apr 2, 2020
- AP Memory Technology Corp.
- Masaru HARAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20200098853
- Publication date Mar 26, 2020
- Zentel Japan Corporation
- Masaru HARAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE
- Publication number 20190198460
- Publication date Jun 27, 2019
- AP Memory Technology Corp.
- Masaru HARAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS

AP Memory Technology (Hangzhou) Limited Co.

Organization

Patents Grantslast 30 patents

Circuit assembly

Method of operating microelectronic package

Device and method of correcting duty cycle

Method to manufacture semiconductor device

Circuit assembly

Method of assembling microelectronic package and method of operatin...

Memory cell, memory device, and related identification tag

Semiconductor device and method to manufacture the same

Capacitor device and manufacturing method therefor

Circuit system having compact decoupling structure

Memory device and microelectronic package having the same

Patents Applicationslast 30 patents

CIRCUIT ASSEMBLY

CIRCUIT ASSEMBLY

DEVICE AND METHOD OF CORRECTING DUTY CYCLE

METHOD OF OPERATING MICROELECTRONIC PACKAGE

METHOD TO MANUFACTURE SEMICONDUCTOR DEVICE

MEMORY CELL, MEMORY DEVICE, AND RELATED IDENTIFICATION TAG

CAPACITOR DEVICE AND MANUFACTURING METHOD THEREFOR

METHOD OF ASSEMBLING MICROELECTRONIC PACKAGE AND METHOD OF OPERATIN...

CIRCUIT ASSEMBLY

CHIP INCLUDING NEURAL NETWORK PROCESSORS AND METHODS FOR MANUFACTUR...

SEMICONDUCTOR DEVICE AND METHOD TO MANUFACTURE THE SAME

MEMORY DEVICE AND MICROELECTRONIC PACKAGE HAVING THE SAME

CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE

CAPACITOR DEVICE AND MANUFACTURING METHOD THEREFOR

CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE

Trademarklast 30 trademarks