ASE ELECTRONICS INC.

Follow

Organization

Kaohsiung, TW

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Thermally enhanced package structure
- Patent number 8,059,422
- Issue date Nov 15, 2011
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING MEASURING TARGETS FOR MEASURING DIMENSIONS OF SUB...
- Publication number 20090258320
- Publication date Oct 15, 2009
- ASE Electronics Inc.
- Hsiang-Ming Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING PROCESS AND STRUCTURE OF A THERMALLY ENHANCED PACKAGE
- Publication number 20090075027
- Publication date Mar 19, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B32 - LAYERED PRODUCTS

Trademarklast 30 trademarks