ASIA ELECTRONIC MATERIAL CO., LTD

Organization

Chubei City, TW

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multi-layered anisotropic conductive adhesive having conductive fab...
- Patent number 11,634,612
- Issue date Apr 25, 2023
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Chih-Ming Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Colored thin covering film and manufacturing method
- Patent number 11,116,074
- Issue date Sep 7, 2021
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered anisotropic conductive adhesive having conductive fab...
- Patent number 10,822,529
- Issue date Nov 3, 2020
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Chih-Ming Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cover film
- Patent number 10,412,866
- Issue date Sep 10, 2019
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Chih-Ming Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cover film
- Patent number 8,765,258
- Issue date Jul 1, 2014
- Asia Electronic Material Co., Ltd
- Chih-Ming Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite double-sided copper foil substrates and flexible printed...
- Patent number 8,536,460
- Issue date Sep 17, 2013
- Asia Electronic Material Co., Ltd.
- Chih-Ming Lin
- B32 - LAYERED PRODUCTS

Please log in for detailed analytics

Patents Applicationslast 30 patents

Information Patent Application
MATTE-TYPE ELECTROMAGNETIC INTERFERENCE SHIELDING FILM COMPRISING B...
- Publication number 20240107731
- Publication date Mar 28, 2024
- ASIA ELECTRONIC MATERIAL CO., LTD
- Bo-Sian DU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING FILM AND PREPARING METHODS T...
- Publication number 20230065194
- Publication date Mar 2, 2023
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTI-LAYERED ANISOTROPIC CONDUCTIVE ADHESIVE HAVING CONDUCTIVE FAB...
- Publication number 20210040356
- Publication date Feb 11, 2021
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Chih-Ming Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTI-LAYERED ANISOTROPIC CONDUCTIVE ADHESIVE HAVING CONDUCTIVE FAB...
- Publication number 20180273809
- Publication date Sep 27, 2018
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Chih-Ming Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COVER FILM
- Publication number 20180255668
- Publication date Sep 6, 2018
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Chih-Ming Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLORED THIN COVERING FILM AND MANUFACTURING METHOD
- Publication number 20180249572
- Publication date Aug 30, 2018
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- B32 - LAYERED PRODUCTS
Information Patent Application
COVER FILM
- Publication number 20160113162
- Publication date Apr 21, 2016
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Chih-Ming Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE DOUBLE-SIDED COPPER FOIL SUBSTRATES AND FLEXIBLE PRINTED...
- Publication number 20110114371
- Publication date May 19, 2011
- ASIA ELECTRONIC MATERIAL CO., LTD
- Chih-Ming Lin
- B32 - LAYERED PRODUCTS
Information Patent Application
COVER LAYER FOR PRINTED CIRCUIT BOARD
- Publication number 20110086192
- Publication date Apr 14, 2011
- ASIA ELECTRONIC MATERIAL CO., LTD
- Chih-Ming Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVER LAYER FOR PRINTED CIRCUIT BOARD
- Publication number 20100330321
- Publication date Dec 30, 2010
- ASIA ELECTRONIC MATERIAL CO., LTD
- Chih-Ming Lin
- G02 - OPTICS

ASIA ELECTRONIC MATERIAL CO., LTD

Organization

Patents Grantslast 30 patents

Multi-layered anisotropic conductive adhesive having conductive fab...

Colored thin covering film and manufacturing method

Multi-layered anisotropic conductive adhesive having conductive fab...

Cover film

Cover film

Composite double-sided copper foil substrates and flexible printed...

Patents Applicationslast 30 patents

MATTE-TYPE ELECTROMAGNETIC INTERFERENCE SHIELDING FILM COMPRISING B...

ELECTROMAGNETIC INTERFERENCE SHIELDING FILM AND PREPARING METHODS T...

MULTI-LAYERED ANISOTROPIC CONDUCTIVE ADHESIVE HAVING CONDUCTIVE FAB...

MULTI-LAYERED ANISOTROPIC CONDUCTIVE ADHESIVE HAVING CONDUCTIVE FAB...

COVER FILM

COLORED THIN COVERING FILM AND MANUFACTURING METHOD

COVER FILM

COMPOSITE DOUBLE-SIDED COPPER FOIL SUBSTRATES AND FLEXIBLE PRINTED...

COVER LAYER FOR PRINTED CIRCUIT BOARD

COVER LAYER FOR PRINTED CIRCUIT BOARD