ASIA PACIFIC MICROSYSTEMS, INC.

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Hsinchu City, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Piezoresistive pressure sensor
- Patent number 10,156,489
- Issue date Dec 18, 2018
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- G01 - MEASURING TESTING
Information Patent Grant
Integrated MEMS device
- Patent number 9,676,609
- Issue date Jun 13, 2017
- Asia Pacific Microsystems, Inc.
- Jerwei Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating semiconductor devices having reinforcing ele...
- Patent number 9,553,055
- Issue date Jan 24, 2017
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Diaphragm piezoresistive pressure sensor
- Patent number 9,459,172
- Issue date Oct 4, 2016
- Asia Pacific Microsystems, Inc.
- Ming-Yan Chen
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating a self-aligned vertical comb drive structure
- Patent number 9,382,113
- Issue date Jul 5, 2016
- Asia Pacific Microsystems, Inc.
- Jer-Wei Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing an integrated MEMS device
- Patent number 9,359,193
- Issue date Jun 7, 2016
- Asia Pacific Microsystems, Inc.
- Jerwei Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for making micro-electromechanical system devices
- Patent number 7,824,945
- Issue date Nov 2, 2010
- Asia Pacific Microsystems, Inc.
- Tso-Chi Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrostatically operated micro-optical devices and method for man...
- Patent number 6,996,306
- Issue date Feb 7, 2006
- Asia Pacific Microsystems, Inc.
- Chih-Chung Chen
- G02 - OPTICS
Information Patent Grant
Method of maintaining photolithographic precision alignment after w...
- Patent number 6,967,145
- Issue date Nov 22, 2005
- Asia Pacific Microsystems, Inc.
- Chung-Yang Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Film bulk acoustic device with integrated tunable and trimmable device
- Patent number 6,924,583
- Issue date Aug 2, 2005
- Asia Pacific Microsystems, Inc.
- Chung-Hsien Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Retro-reflective type optical signal processing device and method
- Patent number 6,901,182
- Issue date May 31, 2005
- Asia Pacific Microsystems, Inc.
- Jer-Liang A. Yeh
- G02 - OPTICS
Information Patent Grant
Fabrication process for bonded wafer precision layer thickness cont...
- Patent number 6,864,176
- Issue date Mar 8, 2005
- Asia Pacific Microsystems, Inc.
- Hung-Dar Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Three-dimensional integrated adjustable inductor, its module and fa...
- Patent number 6,859,129
- Issue date Feb 22, 2005
- Asia Pacific Microsystems
- Shu-Hui Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon pressure sensor and the manufacturing method thereof
- Patent number 6,838,303
- Issue date Jan 4, 2005
- Asia Pacific Microsystems, Inc.
- Hung-Dar Wang
- G01 - MEASURING TESTING
Information Patent Grant
Optical switch
- Patent number 6,804,036
- Issue date Oct 12, 2004
- Asia Pacific Microsystems, Inc.
- Wen-Chih Chen
- G02 - OPTICS
Information Patent Grant
Package structure and method for making the same
- Patent number 6,784,020
- Issue date Aug 31, 2004
- Asia Pacific Microsystems, Inc.
- Chengkuo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bulk acoustic wave multiplexer
- Patent number 6,703,763
- Issue date Mar 9, 2004
- Asia Pacific Microsystems, Inc.
- Shu-Hui Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT CARRIER BOARD
- Publication number 20240292517
- Publication date Aug 29, 2024
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jer-Wei HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIEZORESISTIVE PRESSURE SENSOR
- Publication number 20170219449
- Publication date Aug 3, 2017
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- G01 - MEASURING TESTING
Information Patent Application
Integrated MEMS Device
- Publication number 20160244323
- Publication date Aug 25, 2016
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jerwei Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING REINFORCING ELE...
- Publication number 20160240490
- Publication date Aug 18, 2016
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING HIGH-PRECISION...
- Publication number 20150279664
- Publication date Oct 1, 2015
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Mems Device and Its Manufacturing Method
- Publication number 20150274514
- Publication date Oct 1, 2015
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jerwei Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIAPHRAGM PIEZORESISTIVE PRESSURE SENSOR
- Publication number 20150114129
- Publication date Apr 30, 2015
- ASIA PACIFIC MICROSYSTEMS, INC.
- Ming-Yan Chen
- G01 - MEASURING TESTING
Information Patent Application
Method for Fabricating a Self-Aligned Vertical Comb Drive Structure
- Publication number 20140126031
- Publication date May 8, 2014
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jer-Wei Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Combo Transducer and Combo Transducer Package
- Publication number 20130205899
- Publication date Aug 15, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chang-Wen Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wireless tire pressure and temperature monitoring system
- Publication number 20050274442
- Publication date Dec 15, 2005
- ASIA PACIFIC MICROSYSTEMS, INC.
- Morris Huang
- B60 - VEHICLES IN GENERAL
Information Patent Application
Electrostatically operated micro-optical devices and method for man...
- Publication number 20050047721
- Publication date Mar 3, 2005
- Asia Pacific Microsystems Inc.
- Chih-Chung Chen
- G02 - OPTICS
Information Patent Application
Method of maintaining photolithographic precision alignment after w...
- Publication number 20050013019
- Publication date Jan 20, 2005
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chung-Yang Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Retro-reflective type optical signal processing device and method
- Publication number 20040240779
- Publication date Dec 2, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jer-Liang A. Yeh
- G02 - OPTICS
Information Patent Application
Silicon pressure sensor and the manufacturing method thereof
- Publication number 20040183150
- Publication date Sep 23, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Dar Wang
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20040087043
- Publication date May 6, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chenkuo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and method for optical signal processing system
- Publication number 20040086218
- Publication date May 6, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chun-Kai Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for inductor trimming of the high frequency integrated passi...
- Publication number 20040063039
- Publication date Apr 1, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Shang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional intergrated inductor, its module and fabrication...
- Publication number 20040036569
- Publication date Feb 26, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Shu-Hui Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical signal processing apparatus based on movable tilted reflect...
- Publication number 20040037493
- Publication date Feb 26, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chongkuo Lee
- G02 - OPTICS
Information Patent Application
Thin film acoustic wave device and the manufacturing method thereof
- Publication number 20040007940
- Publication date Jan 15, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Shu-Hui Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Fabrication process for bonded wafer precision layer thickness cont...
- Publication number 20030224610
- Publication date Dec 4, 2003
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Dar Wang
- B24 - GRINDING POLISHING
Information Patent Application
Film bulk acoustic device with integrated tunable and trimmable device
- Publication number 20030205948
- Publication date Nov 6, 2003
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chung-Hsien Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for manufacturing a film bulk acoustic wave filter
- Publication number 20030000058
- Publication date Jan 2, 2003
- ASIA PACIFIC MICROSYSTEMS, INC.
- Shu-Hui Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Manufacturing method for a high quality film bulk acoustic wave device
- Publication number 20020189062
- Publication date Dec 19, 2002
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chung-Hsien Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Micro-electro-mechanical high frequency switch and method for manuf...
- Publication number 20020124385
- Publication date Sep 12, 2002
- ASIA PACIFIC MICROSYSTEM, INC.
- Shu-Hui Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bulk acoustic wave multiplexer
- Publication number 20020109430
- Publication date Aug 15, 2002
- ASIA PACIFIC MICROSYSTEM, INC.
- Shu-Hui Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Bulk acoustic wave filter and its package
- Publication number 20020109564
- Publication date Aug 15, 2002
- ASIA PACIFIC MICROSYSTEM, INC.
- Shu-Hui Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY

ASIA PACIFIC MICROSYSTEMS, INC.

Organization

Patents Grantslast 30 patents

Piezoresistive pressure sensor

Integrated MEMS device

Method for fabricating semiconductor devices having reinforcing ele...

Diaphragm piezoresistive pressure sensor

Method for fabricating a self-aligned vertical comb drive structure

Method for manufacturing an integrated MEMS device

Package structure and substrate bonding method

Method for making micro-electromechanical system devices

Electrostatically operated micro-optical devices and method for man...

Method of maintaining photolithographic precision alignment after w...

Film bulk acoustic device with integrated tunable and trimmable device

Retro-reflective type optical signal processing device and method

Fabrication process for bonded wafer precision layer thickness cont...

Three-dimensional integrated adjustable inductor, its module and fa...

Silicon pressure sensor and the manufacturing method thereof

Optical switch

Package structure and method for making the same

Bulk acoustic wave multiplexer

Patents Applicationslast 30 patents

CIRCUIT CARRIER BOARD

PIEZORESISTIVE PRESSURE SENSOR

Integrated MEMS Device

METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING REINFORCING ELE...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING HIGH-PRECISION...

Integrated Mems Device and Its Manufacturing Method

DIAPHRAGM PIEZORESISTIVE PRESSURE SENSOR

Method for Fabricating a Self-Aligned Vertical Comb Drive Structure

Package Structure and Substrate Bonding Method

Combo Transducer and Combo Transducer Package

Wireless tire pressure and temperature monitoring system

Electrostatically operated micro-optical devices and method for man...

Method of maintaining photolithographic precision alignment after w...

Retro-reflective type optical signal processing device and method

Silicon pressure sensor and the manufacturing method thereof

PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

Apparatus and method for optical signal processing system

Method for inductor trimming of the high frequency integrated passi...

Three-dimensional intergrated inductor, its module and fabrication...

Optical signal processing apparatus based on movable tilted reflect...

Thin film acoustic wave device and the manufacturing method thereof

Fabrication process for bonded wafer precision layer thickness cont...

Film bulk acoustic device with integrated tunable and trimmable device

Method for manufacturing a film bulk acoustic wave filter

Manufacturing method for a high quality film bulk acoustic wave device

Micro-electro-mechanical high frequency switch and method for manuf...

Bulk acoustic wave multiplexer

Bulk acoustic wave filter and its package

Trademarklast 30 trademarks