ASM Assembly Automation Ltd.

Organization

Hong Kong, CN

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Rotary bonding tool which provides a large bond force
- Patent number 8,016,010
- Issue date Sep 13, 2011
- ASM Assembly Automation Ltd.
- Yin Fun Ng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Driving mechanism having position encoder for two-dimensional posit...
- Patent number 8,013,561
- Issue date Sep 6, 2011
- ASM Assembly Automation Ltd.
- Wai Chuen Gan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Driving mechanism having position encoder for two-dimensional posit...
- Patent number 8,013,562
- Issue date Sep 6, 2011
- ASM Assembly Automation Ltd.
- Wai Chuen Gan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wire bonding system utilizing multiple positioning tables
- Patent number 7,654,436
- Issue date Feb 2, 2010
- ASM Assembly Automation Ltd.
- Wing Cheung James Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe comprising tin plating or an intermetallic layer formed t...
- Patent number 7,462,926
- Issue date Dec 9, 2008
- ASM Assembly Automation Ltd.
- Ran Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving mechanism for chip detachment apparatus
- Patent number 7,303,647
- Issue date Dec 4, 2007
- ASM Assembly Automation Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire clamping plate
- Patent number 7,246,735
- Issue date Jul 24, 2007
- ASM Assembly Automation Ltd.
- Deming Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for alignment of a bonding tool
- Patent number 7,240,711
- Issue date Jul 10, 2007
- ASM Assembly Automation Ltd.
- Lai Wa Helen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric device with amplifying mechanism
- Patent number 7,227,295
- Issue date Jun 5, 2007
- ASM Assembly Automation Ltd.
- Siu Wing Or
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Apparatus for loading electronic packages of varying sizes
- Patent number 6,711,873
- Issue date Mar 30, 2004
- ASM Assembly Automation Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flip chip bonding tool
- Publication number 20060076391
- Publication date Apr 13, 2006
- ASM Assembly Automation Ltd.
- Ran Fu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for testing semiconductor devices
- Publication number 20040195665
- Publication date Oct 7, 2004
- ASM ASSEMBLY AUTOMATION LIMITED
- Ching Man Tsui
- G01 - MEASURING TESTING

ASM Assembly Automation Ltd.

Organization

Patents Grantslast 30 patents

Rotary bonding tool which provides a large bond force

Driving mechanism having position encoder for two-dimensional posit...

Driving mechanism having position encoder for two-dimensional posit...

Wire bonding system utilizing multiple positioning tables

Leadframe comprising tin plating or an intermetallic layer formed t...

Driving mechanism for chip detachment apparatus

Wire clamping plate

Apparatus and method for alignment of a bonding tool

Piezoelectric device with amplifying mechanism

Apparatus for loading electronic packages of varying sizes

Patents Applicationslast 30 patents

Flip chip bonding tool

Apparatus and method for testing semiconductor devices

Trademarklast 30 trademarks