ASM ASSEMBLY MATERIALS LTD

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KWAI CHUNG, CN

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Patents Grantslast 30 patents

Information Patent Grant
Stamped leadframe and method of manufacture thereof
- Patent number 8,174,096
- Issue date May 8, 2012
- ASM Assembly Materials Ltd.
- Tat Chi Chan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Leadframe treatment for enhancing adhesion of encapsulant thereto
- Patent number 8,012,886
- Issue date Sep 6, 2011
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Pre-plated leadframe having enhanced encapsulation adhesion
- Patent number 7,691,679
- Issue date Apr 6, 2010
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with enhanced encapsulation adhesion
- Patent number 7,125,750
- Issue date Oct 24, 2006
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stamped leadframe and method of manufacture thereof
- Publication number 20080122048
- Publication date May 29, 2008
- ASM Assembly Materials Ltd.
- Tat Chi Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe with enhanced encapsulation adhesion
- Publication number 20060110855
- Publication date May 25, 2006
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks