ASM NUTOOL, INC.

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Phoenix, AZ, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Filling deep features with conductors in semiconductor manufacturing
- Patent number 7,625,814
- Issue date Dec 1, 2009
- ASM NuTool, Inc.
- Ismail Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling deep features with conductors in semiconductor manufacturing
- Patent number 7,485,561
- Issue date Feb 3, 2009
- ASM Nutool, Inc.
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reduction of defects in wet processed layers
- Patent number 7,189,146
- Issue date Mar 13, 2007
- ASM Nutool, Inc.
- Bulent M. Basol
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of semiconductor interconnect structures
- Patent number 7,172,497
- Issue date Feb 6, 2007
- ASM Nutool, Inc.
- Bulent M. Basol
- B24 - GRINDING POLISHING
Information Patent Grant
Means to improve center to edge uniformity of electrochemical mecha...
- Patent number 7,141,146
- Issue date Nov 28, 2006
- ASM Nutool, Inc.
- Jeffrey Bogart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to improve reliability of copper interconnects
- Patent number 7,129,165
- Issue date Oct 31, 2006
- ASM Nutool, Inc.
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge and bevel cleaning process and system
- Patent number 7,122,473
- Issue date Oct 17, 2006
- ASM Nutool, Inc.
- Jalal Ashjaee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrochemically processing a workpiece
- Patent number 7,115,510
- Issue date Oct 3, 2006
- ASM Nutool, Inc.
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for planar material removal technique using multi-phase proc...
- Patent number 7,101,471
- Issue date Sep 5, 2006
- ASM Nutool, Inc.
- Erol C. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced chemical mechanical polishing system with smart endpoint d...
- Patent number 7,097,538
- Issue date Aug 29, 2006
- ASM NuTool, Inc.
- Homayoun Talieh
- B24 - GRINDING POLISHING
Information Patent Grant
Electrochemical mechanical processing with advancible sweeper
- Patent number 7,097,755
- Issue date Aug 29, 2006
- ASM Nutool, Inc.
- Bulent M. Basol
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for localized material removal by electrochemi...
- Patent number 7,064,057
- Issue date Jun 20, 2006
- ASM Nutool, Inc.
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR COPPER ELECTROPLATING
- Publication number 20090065365
- Publication date Mar 12, 2009
- ASM NUTOOL, INC.
- Ayse Durmus
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS OF FILLING DEEP VIAS FOR 3-D INTEGRATION OF SUBSTRATES
- Publication number 20080242078
- Publication date Oct 2, 2008
- ASM NUTOOL, INC.
- Hessel Sprey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING DEEP FEATURES WITH CONDUCTORS IN SEMICONDUCTOR MANUFACTURING
- Publication number 20070293040
- Publication date Dec 20, 2007
- ASM NUTOOL, INC.
- Ismail Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEANS TO IMPROVE CENTER TO EDGE UNIFORMITY OF ELECTROCHEMICAL MECHA...
- Publication number 20070131563
- Publication date Jun 14, 2007
- ASM NUTOOL, INC.
- Jeffrey Bogart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

ASM NUTOOL, INC.

Organization

Patents Grantslast 30 patents

Filling deep features with conductors in semiconductor manufacturing

Filling deep features with conductors in semiconductor manufacturing

Method for reduction of defects in wet processed layers

Fabrication of semiconductor interconnect structures

Means to improve center to edge uniformity of electrochemical mecha...

Method and structure to improve reliability of copper interconnects

Edge and bevel cleaning process and system

Method for electrochemically processing a workpiece

Method for planar material removal technique using multi-phase proc...

Advanced chemical mechanical polishing system with smart endpoint d...

Electrochemical mechanical processing with advancible sweeper

Method and apparatus for localized material removal by electrochemi...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR COPPER ELECTROPLATING

PROCESS OF FILLING DEEP VIAS FOR 3-D INTEGRATION OF SUBSTRATES

FILLING DEEP FEATURES WITH CONDUCTORS IN SEMICONDUCTOR MANUFACTURING

MEANS TO IMPROVE CENTER TO EDGE UNIFORMITY OF ELECTROCHEMICAL MECHA...