AT&S (CHINA) CO., LTD.

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with well-defined outline sidewall cut by short l...
- Patent number 12,048,101
- Issue date Jul 23, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Traceability of subsequent layer structure manufacturing of main bo...
- Patent number 11,937,369
- Issue date Mar 19, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,700,690
- Issue date Jul 11, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with low shrinkage dielectric material
- Patent number 11,688,668
- Issue date Jun 27, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with improved bending performance
- Patent number 11,672,079
- Issue date Jun 6, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement with central carrier and two opposing layer stacks, com...
- Patent number 11,670,613
- Issue date Jun 6, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flexible component carrier with stepped layer structure
- Patent number 11,589,462
- Issue date Feb 21, 2023
- AT&S(China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded component and horizontally elongate...
- Patent number 11,470,714
- Issue date Oct 11, 2022
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with electrically conductive layer structures hav...
- Patent number 11,452,212
- Issue date Sep 20, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,343,916
- Issue date May 24, 2022
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded large die
- Patent number 11,330,706
- Issue date May 10, 2022
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 11,291,119
- Issue date Mar 29, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,219,129
- Issue date Jan 4, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress relief opening for reducing warpage of component carriers
- Patent number 11,219,120
- Issue date Jan 4, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having a laser via and method of manufacturing
- Patent number 11,166,385
- Issue date Nov 2, 2021
- AT&S (China) Co. Ltd.
- Yee-Bing Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with stabilizing structure for interface adhesion
- Patent number 11,127,670
- Issue date Sep 21, 2021
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising dielectric structures with different p...
- Patent number 11,116,075
- Issue date Sep 7, 2021
- AT&S (China) Co. Ltd.
- Kim Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded by laminate sheet
- Patent number 11,116,083
- Issue date Sep 7, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carriers sandwiching a sacrificial structure and having p...
- Patent number 11,051,410
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally highly conductive coating on base structure accommodating...
- Patent number 11,051,391
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing holes in component carrier material
- Patent number 11,039,535
- Issue date Jun 15, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sacrificial structure with dummy core and two sections of separate...
- Patent number 10,973,133
- Issue date Apr 6, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with improved toughness factor
- Patent number 10,939,548
- Issue date Mar 2, 2021
- AT&S (China) Co. Ltd.
- Artan Baftiri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Component carrier with alternatingly vertically stacked layer struc...
- Patent number 10,834,831
- Issue date Nov 10, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with different surface finishes
- Patent number 10,806,027
- Issue date Oct 13, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component embedding in thinner core using dielectric sheet
- Patent number 10,779,415
- Issue date Sep 15, 2020
- AT&S (China) Co. Ltd.
- Annie Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-finished product for the production of connection systems for...
- Patent number 10,729,013
- Issue date Jul 28, 2020
- AT&S (CHINA) (CO., LTD.
- Peiwang Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Component carrier comprising a copper filled multiple-diameter lase...
- Patent number 10,701,793
- Issue date Jun 30, 2020
- AT&S (China) Co., Ltd.
- Nikolaus Bauer-Öppinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
Component Carrier With Asymmetric Build-Up And Methods for Determin...
- Publication number 20230217589
- Publication date Jul 6, 2023
- AT&S (China) Co. Ltd.
- Diego LORENZONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier
- Publication number 20230180383
- Publication date Jun 8, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing a Component Carrier and a Component Carrier
- Publication number 20230171897
- Publication date Jun 1, 2023
- AT&S (China) Co. Ltd.
- Ismadi Bin ISMAIL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Protection Structure for an Aperture for an Optical Component Embed...
- Publication number 20230038270
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Different Stack Heights and Vertical Opening...
- Publication number 20230043085
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20220256686
- Publication date Aug 11, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20220095457
- Publication date Mar 24, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Well-Defined Outline Sidewall Cut by Short L...
- Publication number 20220061162
- Publication date Feb 24, 2022
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flexible Component Carrier With Stepped Layer Structure
- Publication number 20220039259
- Publication date Feb 3, 2022
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Improved Bending Performance
- Publication number 20210368613
- Publication date Nov 25, 2021
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having Component Covered With Ultra-Thin Transiti...
- Publication number 20210227702
- Publication date Jul 22, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement With Central Carrier And Two Opposing Layer Stacks, Com...
- Publication number 20210202427
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Low Shrinkage Dielectric Material
- Publication number 20210202355
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210185816
- Publication date Jun 17, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...
- Publication number 20210127478
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Electrically Conductive Layer Structures Hav...
- Publication number 20210127496
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Traceability of Subsequent Layer Structure Manufacturing of Main Bo...
- Publication number 20210084752
- Publication date Mar 18, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20210045249
- Publication date Feb 11, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF CONNECTION SYSTEMS FOR...
- Publication number 20200305279
- Publication date Sep 24, 2020
- AT&S (CHINA) CO., LTD.
- Peiwang CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising Dielectric Structures With Different P...
- Publication number 20200281071
- Publication date Sep 3, 2020
- AT&S (China) Co. Ltd.
- Kim Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Holes In Component Carrier Material
- Publication number 20200253051
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Bridge Structure In Through Hole Fulfilling...
- Publication number 20200253050
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20200253054
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier
- Publication number 20200243436
- Publication date Jul 30, 2020
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Improved Toughness Factor
- Publication number 20200236781
- Publication date Jul 23, 2020
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Improved Toughness Factor
- Publication number 20200163211
- Publication date May 21, 2020
- AT&S (China) Co. Ltd.
- Artan Baftiri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of Manufacturing a Component Carrier Using a Separation Comp...
- Publication number 20200163223
- Publication date May 21, 2020
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Large Die
- Publication number 20200163205
- Publication date May 21, 2020
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Improved Bending Performance
- Publication number 20200154558
- Publication date May 14, 2020
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having a Laser Via and Method of Manufacturing
- Publication number 20200137892
- Publication date Apr 30, 2020
- AT&S (China) Co. Ltd.
- Yee-Bing Ling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

AT&S (CHINA) CO., LTD.

Organization

Patents Grantslast 30 patents

Semi-flex component carrier with dielectric material surrounding an...

Component carrier with well-defined outline sidewall cut by short l...

Component carrier having component covered with ultra-thin transiti...

Traceability of subsequent layer structure manufacturing of main bo...

Component carrier with blind hole filled with an electrically condu...

Component carrier with low shrinkage dielectric material

Component carrier with improved bending performance

Arrangement with central carrier and two opposing layer stacks, com...

Semi-flexible component carrier with stepped layer structure

Component carrier with embedded component and horizontally elongate...

Component carrier with electrically conductive layer structures hav...

Component carrier and method of manufacturing the same

Component carrier with embedded large die

Semi-flex component carrier with dielectric material surrounding an...

Component carrier with blind hole filled with an electrically condu...

Stress relief opening for reducing warpage of component carriers

Component carrier having a laser via and method of manufacturing

Component carrier with stabilizing structure for interface adhesion

Component carrier comprising dielectric structures with different p...

Electronic component embedded by laminate sheet

Component carriers sandwiching a sacrificial structure and having p...

Thermally highly conductive coating on base structure accommodating...

Manufacturing holes in component carrier material

Sacrificial structure with dummy core and two sections of separate...

Component carrier with improved toughness factor

Component carrier with alternatingly vertically stacked layer struc...

Component carrier with different surface finishes

Component embedding in thinner core using dielectric sheet

Semi-finished product for the production of connection systems for...

Component carrier comprising a copper filled multiple-diameter lase...

Patents Applicationslast 30 patents

Component Carrier With Asymmetric Build-Up And Methods for Determin...

Component Carrier

Method of Manufacturing a Component Carrier and a Component Carrier

Protection Structure for an Aperture for an Optical Component Embed...

Component Carrier With Different Stack Heights and Vertical Opening...

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

Component Carrier With Blind Hole Filled With An Electrically Condu...

Component Carrier With Well-Defined Outline Sidewall Cut by Short L...

Semi-Flexible Component Carrier With Stepped Layer Structure

Component Carrier With Improved Bending Performance

Component Carrier Having Component Covered With Ultra-Thin Transiti...

Arrangement With Central Carrier And Two Opposing Layer Stacks, Com...

Component Carrier With Low Shrinkage Dielectric Material

Component Carrier and Method of Manufacturing the Same

COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...

Component Carrier With Electrically Conductive Layer Structures Hav...

Traceability of Subsequent Layer Structure Manufacturing of Main Bo...

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF CONNECTION SYSTEMS FOR...

Component Carrier Comprising Dielectric Structures With Different P...

Manufacturing Holes In Component Carrier Material

Component Carrier With Bridge Structure In Through Hole Fulfilling...

Component Carrier With Blind Hole Filled With An Electrically Condu...

Component Carrier

Component Carrier With Improved Toughness Factor

Component Carrier With Improved Toughness Factor

Method of Manufacturing a Component Carrier Using a Separation Comp...

Component Carrier With Embedded Large Die

Component Carrier With Improved Bending Performance

Component Carrier Having a Laser Via and Method of Manufacturing