AYUMI INDUSTRIES COMPANY LIMITED

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Hyogo-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 9,119,336
- Issue date Aug 25, 2015
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for thermal melting process and method of thermal melting...
- Patent number 9,101,995
- Issue date Aug 11, 2015
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for thermal melting process and method of thermal melting...
- Patent number 8,864,011
- Issue date Oct 21, 2014
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 8,757,474
- Issue date Jun 24, 2014
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates and method for irradiating particle b...
- Patent number 7,686,912
- Issue date Mar 30, 2010
- Ayumi Industry Co., Ltd.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates and device for bonding substrates
- Patent number 7,550,366
- Issue date Jun 23, 2009
- Ayumi Industry
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal cell filling method and apparatus
- Patent number 5,725,032
- Issue date Mar 10, 1998
- Ayumi Industry Company Limited
- Nobumasa Oshima
- G02 - OPTICS
Information Patent Grant
Method and dispenser for filling liquid crystal into LCD cell
- Patent number 5,406,989
- Issue date Apr 18, 1995
- Ayumi Industry Co., Ltd.
- Taizo Abe
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CHIP TRANSFER MEMBER, CHIP TRANSFER APPARATUS, AND CHIP TRANSFER ME...
- Publication number 20190252219
- Publication date Aug 15, 2019
- TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20150314385
- Publication date Nov 5, 2015
- AYUMI INDUSTRY CO., LTD.
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for Thermal Melting Process and Method of Thermal Melting...
- Publication number 20150001282
- Publication date Jan 1, 2015
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
- Publication number 20130105558
- Publication date May 2, 2013
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for bonding substrates and device for bonding substrates
- Publication number 20070128825
- Publication date Jun 7, 2007
- TADATOMO SUGA
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS

AYUMI INDUSTRIES COMPANY LIMITED

Organization

Patents Grantslast 30 patents

Bonding structure manufacturing method, heating and melting treatme...

Apparatus for thermal melting process and method of thermal melting...

Apparatus for thermal melting process and method of thermal melting...

Bonding structure manufacturing method, heating and melting treatme...

Method for bonding substrates and method for irradiating particle b...

Method for bonding substrates and device for bonding substrates

Liquid crystal cell filling method and apparatus

Method and dispenser for filling liquid crystal into LCD cell

Patents Applicationslast 30 patents

CHIP TRANSFER MEMBER, CHIP TRANSFER APPARATUS, AND CHIP TRANSFER ME...

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

Apparatus for Thermal Melting Process and Method of Thermal Melting...

Bonding Structure Manufacturing Method, Heating And Melting Treatme...

Method for bonding substrates and device for bonding substrates

Trademarklast 30 trademarks