Beijing ESWIN Technology Co., Ltd

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Patents Grantslast 30 patents

Information Patent Grant
Multiple wafers fabrication technique on large carrier with warpage...
- Patent number 10,424,524
- Issue date Sep 24, 2019
- CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION FOR TEMPORARY BONDING OF SEMICONDUCTOR WORKPIE...
- Publication number 20190276712
- Publication date Sep 12, 2019
- Chengdu ESWIN SiP Technology Co., Ltd.
- Chunbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
79250935 - ESWIN
- Serial number 79250935
- Registration number 5963932
- Filing date Oct 31, 2018
- Beijing ESWIN Materials Technology Co., Ltd.
- 7 - Machines and machine tools