Besi Switzerland AG

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Cham, CH

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Patents Grantslast 30 patents

Information Patent Grant
Die ejector
- Patent number 12,062,566
- Issue date Aug 13, 2024
- BESI Switzerland AG
- Fabian Hurschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for detaching a die from an adhesive film
- Patent number 11,996,385
- Issue date May 28, 2024
- BESI Switzerland AG
- Andreas Mayr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting components on a substrate
- Patent number 11,924,974
- Issue date Mar 5, 2024
- Besi Switzerland AG
- Norbert Bilewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for mounting components on a substrate
- Patent number 11,696,429
- Issue date Jul 4, 2023
- Besi Switzerland AG
- Norbert Bilewicz
- G05 - CONTROLLING REGULATING
Information Patent Grant
Apparatus and method for mounting components on a substrate
- Patent number 10,973,158
- Issue date Apr 6, 2021
- Besi Switzerland AG
- Norbert Bilewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for calibrating a component mounting apparatus
- Patent number 10,629,465
- Issue date Apr 21, 2020
- BESI Switzerland AG
- Harald Handlos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting components on a substrate
- Patent number 10,288,413
- Issue date May 14, 2019
- Besi Switzerland AG
- Norbert Bilewicz
- G05 - CONTROLLING REGULATING
Information Patent Grant
Kinematic holding system for a placement head of a placement apparatus
- Patent number 9,956,692
- Issue date May 1, 2018
- Besi Switzerland AG
- Hannes Kostner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Device for dispensing and distributing flux-free solder on a substrate
- Patent number 9,889,516
- Issue date Feb 13, 2018
- Besi Switzerland AG
- Christoffer Stroemberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting semiconductors provided with bumps on substrate...
- Patent number 9,721,819
- Issue date Aug 1, 2017
- Besi Switzerland AG
- Florian Speer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through type furnace for substrates comprising a longitudinal slit
- Patent number 9,666,460
- Issue date May 30, 2017
- Besi Switzerland AG
- Guido Suter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Kinematic holding system for a placement head of a placement apparatus
- Patent number 9,364,953
- Issue date Jun 14, 2016
- Besi Switzerland AG
- Hannes Kostner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method and apparatus for dispensing flux-free solder on a substrate
- Patent number 9,339,885
- Issue date May 17, 2016
- Besi Switzerland AG
- Heinrich Berchtold
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for detaching a semiconductor chip from a foil
- Patent number 9,240,334
- Issue date Jan 19, 2016
- Besi Switzerland AG
- Ernst Barmettler
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for dispensing adhesive on a substrate
- Patent number 9,233,389
- Issue date Jan 12, 2016
- Besi Switzerland AG
- Ruedi Grueter
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for detaching a semiconductor chip from a foil
- Patent number 9,039,867
- Issue date May 26, 2015
- Besi Switzerland AG
- Ernst Barmettler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding head with a heatable and coolable suction member
- Patent number 8,925,608
- Issue date Jan 6, 2015
- Besi Switzerland AG
- Andreas Mayr
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Die Ejector
- Publication number 20240363386
- Publication date Oct 31, 2024
- BESI Switzerland AG
- Fabian Hurschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR OPTICAL INSPECTING THREE OR MORE SIDES OF...
- Publication number 20240230552
- Publication date Jul 11, 2024
- BESI Switzerland AG
- Ralf WEISE
- G01 - MEASURING TESTING
Information Patent Application
Apparatus for mounting components on a substrate
- Publication number 20230284426
- Publication date Sep 7, 2023
- Besi Switzerland AG
- Norbert BILEWICZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Ejector
- Publication number 20210391205
- Publication date Dec 16, 2021
- BESI Switzerland AG
- Fabian Hurschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actuator for a Bonding Head
- Publication number 20210272925
- Publication date Sep 2, 2021
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Detaching a Die from an Adhesive Film
- Publication number 20210265302
- Publication date Aug 26, 2021
- BESI Switzerland AG
- Andreas Mayr
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Apparatus and method for mounting components on a substrate
- Publication number 20210195816
- Publication date Jun 24, 2021
- Besi Switzerland AG
- Norbert BILEWICZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for calibrating a component mounting apparatus
- Publication number 20190362998
- Publication date Nov 28, 2019
- BESI Switzerland AG
- Harald HANDLOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding head for mounting components and die bonder with such a bon...
- Publication number 20190157122
- Publication date May 23, 2019
- BESI Switzerland AG
- Rene KROEHNERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting components on a substrate
- Publication number 20180317353
- Publication date Nov 1, 2018
- Besi Switzerland AG
- Norbert BILEWICZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Mounting Components On A Substrate
- Publication number 20170092613
- Publication date Mar 30, 2017
- Besi Switzerland AG
- Norbert Bilewicz
- G02 - OPTICS
Information Patent Application
Method For Mounting Semiconductors Provided With Bumps On Substrate...
- Publication number 20170062257
- Publication date Mar 2, 2017
- Besi Switzerland AG
- Florian Speer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Dispensing Flux-Free Solder On A Substrate
- Publication number 20160256949
- Publication date Sep 8, 2016
- Besi Switzerland AG
- Heinrich Berchtold
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Kinematic Holding System For A Placement Head Of A Placement Apparatus
- Publication number 20160167237
- Publication date Jun 16, 2016
- Besi Switzerland AG
- Hannes Kostner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Through-Type Furnace For Substrates To Be Fitted With Components An...
- Publication number 20150136836
- Publication date May 21, 2015
- Besi Switzerland AG
- Guido Suter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device For Dispensing And Distributing Flux-Free Solder On A Substrate
- Publication number 20150008249
- Publication date Jan 8, 2015
- Besi Switzerland AG
- Christoffer Stroemberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method And Apparatus For Mounting Electronic Or Optical Components...
- Publication number 20140311652
- Publication date Oct 23, 2014
- Besi Switzerland AG
- Hannes Kostner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device For Dispensing Adhesive On A Substrate
- Publication number 20140305372
- Publication date Oct 16, 2014
- Besi Switzerland AG
- Ruedi Grueter
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Bonding Head With A Heatable And Coolable Suction Member
- Publication number 20140202636
- Publication date Jul 24, 2014
- Besi Switzerland AG
- Andreas Mayr
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20140196853
- Publication date Jul 17, 2014
- Besi Switzerland AG
- Ernst Barmettler
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding Method And Apparatus For Mounting Semicon...
- Publication number 20140175159
- Publication date Jun 26, 2014
- Besi Switzerland AG
- Hannes Kostner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Kinematic Holding System For A Placement Head Of A Placement Apparatus
- Publication number 20140030052
- Publication date Jan 30, 2014
- Besi Switzerland AG
- Hannes Kostner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20130255889
- Publication date Oct 3, 2013
- Besi Switzerland AG
- Ernst Barmettler
- H01 - BASIC ELECTRIC ELEMENTS

Besi Switzerland AG

Organization

Patents Grantslast 30 patents

Die ejector

Bonding head for mounting components and die bonder with such a bon...

Apparatus and method for detaching a die from an adhesive film

Apparatus for mounting components on a substrate

Apparatus and method for mounting components on a substrate

Apparatus and method for mounting components on a substrate

Method for calibrating a component mounting apparatus

Apparatus for mounting components on a substrate

Kinematic holding system for a placement head of a placement apparatus

Device for dispensing and distributing flux-free solder on a substrate

Method for mounting semiconductors provided with bumps on substrate...

Through type furnace for substrates comprising a longitudinal slit

Kinematic holding system for a placement head of a placement apparatus

Method and apparatus for dispensing flux-free solder on a substrate

Method for detaching a semiconductor chip from a foil

Device for dispensing adhesive on a substrate

Method for detaching a semiconductor chip from a foil

Bonding head with a heatable and coolable suction member

Patents Applicationslast 30 patents

Die Ejector

APPARATUS AND METHOD FOR OPTICAL INSPECTING THREE OR MORE SIDES OF...

Apparatus for mounting components on a substrate

Die Ejector

Actuator for a Bonding Head

Apparatus and Method for Detaching a Die from an Adhesive Film

Apparatus and method for mounting components on a substrate

Method for calibrating a component mounting apparatus

Bonding head for mounting components and die bonder with such a bon...

Apparatus and method for mounting components on a substrate

Apparatus For Mounting Components On A Substrate

Method For Mounting Semiconductors Provided With Bumps On Substrate...

Apparatus For Dispensing Flux-Free Solder On A Substrate

Kinematic Holding System For A Placement Head Of A Placement Apparatus

Through-Type Furnace For Substrates To Be Fitted With Components An...

Device For Dispensing And Distributing Flux-Free Solder On A Substrate

Method And Apparatus For Mounting Electronic Or Optical Components...

Device For Dispensing Adhesive On A Substrate

Bonding Head With A Heatable And Coolable Suction Member

Method For Detaching A Semiconductor Chip From A Foil

Thermocompression Bonding Method And Apparatus For Mounting Semicon...

Kinematic Holding System For A Placement Head Of A Placement Apparatus

Method For Detaching A Semiconductor Chip From A Foil

Trademarklast 30 trademarks