TREA

Blondwich Limited

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Organization

  • Tsuen Wan, HK
Organizations

Patents Grantslast 30 patents

  • Information Patent Grant

    Enhanced integrated circuit package
    • Patent number 8,124,462
    • Issue date Feb 28, 2012
    • Blondwich Limited
    • Tung Lok Li
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

  • Information Patent Application

    ENHANCED INTEGRATED CIRCUIT PACKAGE
    • Publication number 20110219611
    • Publication date Sep 15, 2011
    • Blondwich Limited
    • Tung Lok LI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ENHANCED INTEGRATED CIRCUIT PACKAGE
    • Publication number 20100314732
    • Publication date Dec 16, 2010
    • Blondwich Limited
    • Tung Lok LI
    • H01 - BASIC ELECTRIC ELEMENTS