TREA

Blondwich Limited

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  • Hong Kong SAR, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Enhanced integrated circuit package
    • Patent number 7,973,394
    • Issue date Jul 5, 2011
    • Blondwich Limited
    • Tung Lok Li
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC