BROADCOM INTERNATIONAL PTE. LTD

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SINGAPORE, SG

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Patents Grantslast 30 patents

Information Patent Grant
Extended HBM offsets in 2.5D interposers
- Patent number 11,538,790
- Issue date Dec 27, 2022
- BROADCOM INTERNATIONAL PTE. LTD.
- Mohamed Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing a configurable storage media interface
- Patent number 10,990,307
- Issue date Apr 27, 2021
- BROADCOM INTERNATIONAL PTE. LTD.
- Shaohua Yang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL AND OPTICAL CONNECTOR
- Publication number 20240069296
- Publication date Feb 29, 2024
- Broadcom International Pte. Ltd.
- David John Kenneth Meadowcroft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND SPOT SIZE CONVERTER FOR FIBER EDGE COUPLING
- Publication number 20240036263
- Publication date Feb 1, 2024
- Broadcom International Pte. Ltd.
- Nourhan Eid
- G02 - OPTICS
Information Patent Application
MACROCHIP WITH INTERCONNECT STACK FOR POWER DELIVERY AND SIGNAL ROU...
- Publication number 20230352415
- Publication date Nov 2, 2023
- Broadcom International Pte. Ltd.
- Thomas Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Connected Glass Modules on a Glass Board
- Publication number 20230290703
- Publication date Sep 14, 2023
- Broadcom International Pte. Ltd.
- Thomas Edward DUNGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Synchronization Signal (Sync Mark) Detection Using Multi-Frequency...
- Publication number 20230254109
- Publication date Aug 10, 2023
- Broadcom International Pte. Ltd.
- Jeffrey Grundvig
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SILICON PHOTONIC EDGE COUPLED CONNECTOR VIA COLLIMATION
- Publication number 20230251428
- Publication date Aug 10, 2023
- Broadcom International Pte. Ltd.
- Rebecca Schaevitz
- G02 - OPTICS
Information Patent Application
STAGGERED SHIELD WIRES EXTENDING ALONG SUBSECTIONS OF SIGNAL WIRES
- Publication number 20230245973
- Publication date Aug 3, 2023
- Broadcom International Pte. Ltd.
- Mohamed Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...
- Publication number 20220384407
- Publication date Dec 1, 2022
- Broadcom International Pte. Ltd.
- Thomas Edward DUNGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED HBM OFFSETS IN 2.5D INTERPOSERS
- Publication number 20220302080
- Publication date Sep 22, 2022
- Broadcom International Pte. Ltd.
- Mohamed Anwar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO APPLY MICROLENS ON SMALL APERTURE PHOTODETECTORS AND VCS...
- Publication number 20220209496
- Publication date Jun 30, 2022
- Broadcom International Pte. Ltd.
- Tak Kui Wang
- H01 - BASIC ELECTRIC ELEMENTS

BROADCOM INTERNATIONAL PTE. LTD

Organization

Patents Grantslast 30 patents

Extended HBM offsets in 2.5D interposers

System and method for providing a configurable storage media interface

Patents Applicationslast 30 patents

ELECTRICAL AND OPTICAL CONNECTOR

DIAMOND SPOT SIZE CONVERTER FOR FIBER EDGE COUPLING

MACROCHIP WITH INTERCONNECT STACK FOR POWER DELIVERY AND SIGNAL ROU...

Copper Connected Glass Modules on a Glass Board

Synchronization Signal (Sync Mark) Detection Using Multi-Frequency...

SILICON PHOTONIC EDGE COUPLED CONNECTOR VIA COLLIMATION

STAGGERED SHIELD WIRES EXTENDING ALONG SUBSECTIONS OF SIGNAL WIRES

COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...

EXTENDED HBM OFFSETS IN 2.5D INTERPOSERS

METHODS TO APPLY MICROLENS ON SMALL APERTURE PHOTODETECTORS AND VCS...

Trademarklast 30 trademarks