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Carsem Semiconductor SDN, BHD.

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  • Perak, MY
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for sawing a moulded leadframe package
    • Patent number 6,544,817
    • Issue date Apr 8, 2003
    • Carsem Semiconductor SDN. BHD.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip-chip on lead frame
    • Patent number 6,482,680
    • Issue date Nov 19, 2002
    • Carsem Semiconductor SDN, BHD.
    • Lily Khor
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Method of manufacturing a cavity package
    • Publication number 20060148127
    • Publication date Jul 6, 2006
    • Carsem Semiconductor Sdn. Bhd.
    • King Hoo Ong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Method for encapsulating lead frame packages
    • Publication number 20050287715
    • Publication date Dec 29, 2005
    • Carsem Semiconductor SDN. BHD.
    • Richard Yee Mow Lum
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stress-free lead frame
    • Publication number 20050104169
    • Publication date May 19, 2005
    • Carsem Semiconductor Sdn. Bhd.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks