CATLAM LLC

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SUNNYVALE, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 11,477,893
- Issue date Oct 18, 2022
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board
- Patent number 11,406,024
- Issue date Aug 2, 2022
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board...
- Patent number 11,039,540
- Issue date Jun 15, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 10,827,624
- Issue date Nov 3, 2020
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for printed circuit boards using backing foil
- Patent number 10,765,012
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a multi-layer circuit board using conductive past...
- Patent number 10,765,003
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming contacts on an integrated circuit...
- Patent number 10,685,931
- Issue date Jun 16, 2020
- CATLAM LLC
- Kenneth S. Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for wafer level packaging
- Patent number 10,573,610
- Issue date Feb 25, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-layer circuit board using interposer layer and conductive paste
- Patent number 10,349,520
- Issue date Jul 9, 2019
- CATLAM, LLC
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20230247774
- Publication date Aug 3, 2023
- CATLAM, LLC
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit Board Traces in Channels using Electroless and Electroplate...
- Publication number 20230096301
- Publication date Mar 30, 2023
- CATLAM, LLC
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-Layer Circuit Board with Traces Thicker than a Circuit Board
- Publication number 20210282274
- Publication date Sep 9, 2021
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process For Forming Traces on a Catalytic Laminate
- Publication number 20210051804
- Publication date Feb 18, 2021
- CATLAM, LLC
- Kenneth S. BAHL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20210022252
- Publication date Jan 21, 2021
- CATLAM LLC
- Kenneth S BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20200389983
- Publication date Dec 10, 2020
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Circuit Board with Traces Thicker than a Circuit Board...
- Publication number 20200214144
- Publication date Jul 2, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for making a Multi-Layer Circuit Board using conductive Past...
- Publication number 20190320530
- Publication date Oct 17, 2019
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Organization

Patents Grantslast 30 patents

Electroless and electrolytic deposition process for forming traces...

Process for fabrication of a printed circuit board using a semi-add...

Catalytic laminate with conductive traces formed during lamination

Multi-layer circuit board with traces thicker than a circuit board

Multi-layer circuit board with traces thicker than a circuit board...

Circuit board using non-catalytic laminate with catalytic adhesive...

Process for forming traces on a catalytic laminate

Catalytic laminate with conductive traces formed during lamination

Catalytic circuit board with traces and vias

Process for printed circuit boards using backing foil

Method for making a multi-layer circuit board using conductive past...

Method and apparatus for forming contacts on an integrated circuit...

Method for wafer level packaging

Multi-layer circuit board using interposer layer and conductive paste

Patents Applicationslast 30 patents

Semi-Additive Process for Printed Circuit Boards

Circuit Board Traces in Channels using Electroless and Electroplate...

Multi-Layer Circuit Board with Traces Thicker than a Circuit Board

Process For Forming Traces on a Catalytic Laminate

Catalytic Laminate with Conductive Traces formed during Lamination

Circuit Board using non-catalytic laminate with catalytic adhesive...

Semi-Additive Process for Printed Circuit Boards

Multi-Layer Circuit Board with Traces Thicker than a Circuit Board...

Method for making a Multi-Layer Circuit Board using conductive Past...

Trademarklast 30 trademarks