Challentech International Corporation

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Zhubei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Device packaging method and device package structure
- Patent number 9,299,862
- Issue date Mar 29, 2016
- Challentech International Corporation
- Chung-I Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer Level Package Structure for Temperature Sensing Elements
- Publication number 20160020377
- Publication date Jan 21, 2016
- Challentech International Corporation
- Chung-I Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Packaging Method and Device Package Structure
- Publication number 20150243799
- Publication date Aug 27, 2015
- Challentech International Corporation
- Chung-I Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intelligent Monitoring System
- Publication number 20150213317
- Publication date Jul 30, 2015
- Challentech International Corporation
- Chung-I Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Care Service Transaction Method and System Thereof
- Publication number 20150213209
- Publication date Jul 30, 2015
- Challentech International Corporation
- Chung-I Chiang
- G06 - COMPUTING CALCULATING COUNTING

Trademarklast 30 trademarks