Cheng Kung Capital, LLC

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Wilmington, DE, US

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Patents Grantslast 30 patents

Information Patent Grant
Processes for manufacturing an LED package with top and bottom elec...
- Patent number 8,802,503
- Issue date Aug 12, 2014
- Cheng Kung Capital, LLC
- Jiahn-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package with top and bottom electrodes
- Patent number 8,710,540
- Issue date Apr 29, 2014
- Cheng Kung Capital, LLC
- Jiahn-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for manufacturing an LED package with top and bottom elec...
- Patent number 8,524,541
- Issue date Sep 3, 2013
- Cheng Kung Capital, LLC
- Jiahn-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package with top and bottom electrodes
- Patent number 8,247,835
- Issue date Aug 21, 2012
- Cheng Kung Capital, LLC
- Jiahn-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSES FOR MANUFACTURING AN LED PACKAGE WITH TOP AND BOTTOM ELEC...
- Publication number 20140193930
- Publication date Jul 10, 2014
- Cheng Kung Capital, LLC
- Jiahn-Chang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR MANUFACTURING AN LED PACKAGE WITH TOP AND BOTTOM ELEC...
- Publication number 20140042483
- Publication date Feb 13, 2014
- Cheng Kung Capital, LLC
- Jiahn-Chang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE WITH TOP-BOTTOM ELECTRODE
- Publication number 20120273835
- Publication date Nov 1, 2012
- Cheng Kung Capital, LLC
- Jiahn-Chang WU
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks