CHENGDU ESWIN SIP TECHNOLOGY CO., LTD

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CHENGDU CITY, CN

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulated fan-in semiconductor package with heat spreader and me...
- Patent number 11,488,931
- Issue date Nov 1, 2022
- CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for temporary bonding of semiconductor workpie...
- Patent number 11,274,234
- Issue date Mar 15, 2022
- CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
- Chunbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of debonding work-carrier pair with thin devices
- Patent number 11,177,153
- Issue date Nov 16, 2021
- CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
- Chunbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple wafers fabrication technique on large carrier with warpage...
- Patent number 10,424,524
- Issue date Sep 24, 2019
- CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED FAN-IN SEMICONDUCTOR PACKAGE WITH HEAT SPREADER AND ME...
- Publication number 20210242169
- Publication date Aug 5, 2021
- Chengdu ESWIN SiP Technology Co., Ltd.
- Minghao SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION FOR TEMPORARY BONDING OF SEMICONDUCTOR WORKPIE...
- Publication number 20190276712
- Publication date Sep 12, 2019
- Chengdu ESWIN SiP Technology Co., Ltd.
- Chunbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks