China Wafer Level CSP Co., Ltd.

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Suzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulation structure of image sensing chip, and encapsulation me...
- Patent number 11,049,899
- Issue date Jun 29, 2021
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical fingerprint recognition chip package and packaging method
- Patent number 10,817,700
- Issue date Oct 27, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensing chip package and image sensing chip packaging method
- Patent number 10,763,293
- Issue date Sep 1, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacture method of the same
- Patent number 10,685,917
- Issue date Jun 16, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip package
- Patent number 10,680,033
- Issue date Jun 9, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure and package-on-package method
- Patent number 10,541,264
- Issue date Jan 21, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing chip packaging structure and packaging method
- Patent number 10,541,262
- Issue date Jan 21, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and chip packaging method
- Patent number 10,541,186
- Issue date Jan 21, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and packaging structure
- Patent number 10,529,758
- Issue date Jan 7, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensing chip packaging method and fingerprint sensing c...
- Patent number 10,497,728
- Issue date Dec 3, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging structure and packaging method
- Patent number 10,490,583
- Issue date Nov 26, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package structure and packaging method therefor
- Patent number 10,418,296
- Issue date Sep 17, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure for image sensing chip
- Patent number 10,325,946
- Issue date Jun 18, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure for image sensing chip
- Patent number 10,283,483
- Issue date May 7, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip packaging structure
- Patent number 10,276,540
- Issue date Apr 30, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition chip packaging structure and packaging method
- Patent number 10,133,907
- Issue date Nov 20, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer-level chip package structure and packaging method
- Patent number 10,126,151
- Issue date Nov 13, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint recognition chip packaging structure and packaging method
- Patent number 10,108,837
- Issue date Oct 23, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint recognition chip packaging structure and packaging method
- Patent number 10,096,643
- Issue date Oct 9, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip packaging method and package structure
- Patent number 10,090,217
- Issue date Oct 2, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip to wafer package with top electrodes and method of forming
- Patent number 9,748,162
- Issue date Aug 29, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging structure for image sensors with packaging co...
- Patent number 9,601,531
- Issue date Mar 21, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method of BSI image sensors having different...
- Patent number 9,455,298
- Issue date Sep 27, 2016
- China Wafer Level CSP Co., Ltd.
- Zhi-Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method of BSI image sensors having different...
- Patent number 9,305,961
- Issue date Apr 5, 2016
- China Wafer Level CSP Co., Ltd.
- Zhi-Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure and method
- Patent number 9,299,735
- Issue date Mar 29, 2016
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging structure for image sensors and wafer level p...
- Patent number 9,231,018
- Issue date Jan 5, 2016
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATION STRUCTURE OF IMAGE SENSING CHIP, AND ENCAPSULATION ME...
- Publication number 20200303448
- Publication date Sep 24, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20200243588
- Publication date Jul 30, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FINGERPRINT RECOGNITION CHIP PACKAGE AND PACKAGING METHOD
- Publication number 20200234028
- Publication date Jul 23, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT CHIP PACKAGING METHOD AND FINGERPRINT CHIP PACKAGE
- Publication number 20200051938
- Publication date Feb 13, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE FOR SEMICONDUCTOR CHIP
- Publication number 20190296064
- Publication date Sep 26, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20190259634
- Publication date Aug 22, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CHIP PACKAGING METHOD
- Publication number 20190202685
- Publication date Jul 4, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURE METHOD OF THE SAME
- Publication number 20190206801
- Publication date Jul 4, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FINGERPRINT RECOGNITION CHIP PACKAGE AND PACKAGING METHOD
- Publication number 20190188447
- Publication date Jun 20, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT CHIP PACKAGING METHOD AND FINGERPRINT CHIP PACKAGE
- Publication number 20190189578
- Publication date Jun 20, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE
- Publication number 20190189675
- Publication date Jun 20, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND PACKAGE-ON-PACKAGE METHOD
- Publication number 20190165028
- Publication date May 30, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING CHIP PACKAGE AND IMAGE SENSING CHIP PACKAGING METHOD
- Publication number 20190165030
- Publication date May 30, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR IRIS RECOGNITION IMAGING MODULE AND MANUFACTURING METHO...
- Publication number 20190165013
- Publication date May 30, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20190074309
- Publication date Mar 7, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PAD, SEMICONDUCTOR CHIP COMPRISING SOLDER PAD, AND FORMING M...
- Publication number 20190074258
- Publication date Mar 7, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE CHIP PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20190067352
- Publication date Feb 28, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD OF MEMS CHIP AND ASIC CHIP
- Publication number 20190010046
- Publication date Jan 10, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR FINGERPRINT RECOGNITION...
- Publication number 20190013302
- Publication date Jan 10, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREFOR
- Publication number 20190006253
- Publication date Jan 3, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20190006404
- Publication date Jan 3, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CHIP PACKAGING METHOD
- Publication number 20180366387
- Publication date Dec 20, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20180337206
- Publication date Nov 22, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR
- Publication number 20180308890
- Publication date Oct 25, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20180301488
- Publication date Oct 18, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20180294302
- Publication date Oct 11, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR IMAGE SENSING CHIP
- Publication number 20180286903
- Publication date Oct 4, 2018
- China Wafer Level CSP Co., Ltd
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20180247962
- Publication date Aug 30, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20180240827
- Publication date Aug 23, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSING CHIP PACKAGING METHOD AND FINGERPRINT SENSING C...
- Publication number 20180145102
- Publication date May 24, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING

China Wafer Level CSP Co., Ltd.

Organization

Patents Grantslast 30 patents

Encapsulation structure of image sensing chip, and encapsulation me...

Optical fingerprint recognition chip package and packaging method

Image sensing chip package and image sensing chip packaging method

Semiconductor device and manufacture method of the same

Chip packaging method and chip package

Package-on-package structure and package-on-package method

Image sensing chip packaging structure and packaging method

Chip package and chip packaging method

Packaging method and packaging structure

Fingerprint sensing chip packaging method and fingerprint sensing c...

Packaging structure and packaging method

Semiconductor chip package structure and packaging method therefor

Packaging method and package structure for image sensing chip

Packaging method and package structure for image sensing chip

Chip packaging method and chip packaging structure

Fingerprint recognition chip packaging structure and packaging method

Wafer-level chip package structure and packaging method

Fingerprint recognition chip packaging structure and packaging method

Fingerprint recognition chip packaging structure and packaging method

Chip packaging method and package structure

Chip to wafer package with top electrodes and method of forming

Wafer-level packaging structure for image sensors with packaging co...

Wafer-level packaging method of BSI image sensors having different...

Wafer-level packaging method of BSI image sensors having different...

Image sensor package structure and method

Wafer level packaging structure for image sensors and wafer level p...

Patents Applicationslast 30 patents

ENCAPSULATION STRUCTURE OF IMAGE SENSING CHIP, AND ENCAPSULATION ME...

PACKAGING STRUCTURE AND PACKAGING METHOD

OPTICAL FINGERPRINT RECOGNITION CHIP PACKAGE AND PACKAGING METHOD

FINGERPRINT CHIP PACKAGING METHOD AND FINGERPRINT CHIP PACKAGE

PACKAGING METHOD AND PACKAGING STRUCTURE FOR SEMICONDUCTOR CHIP

PACKAGING STRUCTURE AND PACKAGING METHOD

CHIP PACKAGE AND CHIP PACKAGING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURE METHOD OF THE SAME

OPTICAL FINGERPRINT RECOGNITION CHIP PACKAGE AND PACKAGING METHOD

FINGERPRINT CHIP PACKAGING METHOD AND FINGERPRINT CHIP PACKAGE

CHIP PACKAGING METHOD AND CHIP PACKAGE

PACKAGE-ON-PACKAGE STRUCTURE AND PACKAGE-ON-PACKAGE METHOD

IMAGE SENSING CHIP PACKAGE AND IMAGE SENSING CHIP PACKAGING METHOD

PACKAGE FOR IRIS RECOGNITION IMAGING MODULE AND MANUFACTURING METHO...

IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

SOLDER PAD, SEMICONDUCTOR CHIP COMPRISING SOLDER PAD, AND FORMING M...

PHOTOSENSITIVE CHIP PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF

PACKAGING STRUCTURE AND PACKAGING METHOD OF MEMS CHIP AND ASIC CHIP

PACKAGING METHOD AND PACKAGE STRUCTURE FOR FINGERPRINT RECOGNITION...

SEMICONDUCTOR CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREFOR

PACKAGING STRUCTURE AND PACKAGING METHOD

CHIP PACKAGE AND CHIP PACKAGING METHOD

PACKAGE STRUCTURE AND PACKAGING METHOD

IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR

IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

IMAGE SENSING CHIP PACKAGING STRUCTURE AND METHOD

PACKAGING METHOD AND PACKAGE STRUCTURE FOR IMAGE SENSING CHIP

IMAGE SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

PACKAGE STRUCTURE AND PACKAGING METHOD

FINGERPRINT SENSING CHIP PACKAGING METHOD AND FINGERPRINT SENSING C...

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