CHIPSCALE, INC

Organization

SAN JOSE, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Integrated passive components and package with posts
- Patent number 6,954,130
- Issue date Oct 11, 2005
- ChipScale, Inc.
- Phil P. Marcoux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive components and package with posts
- Patent number 6,946,734
- Issue date Sep 20, 2005
- ChipScale, Inc.
- Phil P. Marcoux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive components and package with posts
- Patent number 6,833,986
- Issue date Dec 21, 2004
- ChipScale, Inc.
- Phil P. Marcoux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive components and package with posts
- Patent number 6,414,585
- Issue date Jul 2, 2002
- ChipScale, Inc.
- Phil P. Marcoux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer fabrication of inside-wrapped contacts for electronic devices
- Patent number 6,355,981
- Issue date Mar 12, 2002
- ChipScale, Inc.
- John G. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer fabrication of die-bottom contacts for electronic devices
- Patent number 6,221,751
- Issue date Apr 24, 2001
- ChipScale, Inc.
- Changsheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor fabrication
- Patent number 6,121,119
- Issue date Sep 19, 2000
- ChipScale, Inc.
- John G. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package with posts on the active side of the s...
- Patent number 6,051,489
- Issue date Apr 18, 2000
- ChipScale, Inc.
- James L. Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer fabrication of die-bottom contacts for electronic devices
- Patent number 5,910,687
- Issue date Jun 8, 1999
- ChipScale, Inc.
- Changsheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer fabrication of inside-wrapped contacts for electronic devices
- Patent number 5,904,496
- Issue date May 18, 1999
- ChipScale, Inc.
- John G. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical apparatus with a metallic layer coupled to a lower regio...
- Patent number 5,789,817
- Issue date Aug 4, 1998
- ChipScale, Inc.
- John Gareth Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a leadless surface mounted device with wrap-aroun...
- Patent number 5,656,547
- Issue date Aug 12, 1997
- ChipScale, Inc.
- John G. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a semiconductor with an insulative coating
- Patent number 5,592,022
- Issue date Jan 7, 1997
- ChipScale, Inc.
- John G. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication with contact processing for wrap-around f...
- Patent number 5,557,149
- Issue date Sep 17, 1996
- ChipScale, Inc.
- John G. Richards
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
75274589 - MICROGRID ARRAY
- Serial number 75274589
- Filing date Apr 14, 1997
- ChipScale Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75274233 - UGA
- Serial number 75274233
- Filing date Apr 14, 1997
- ChipScale Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74556225 - MICRO SMT
- Serial number 74556225
- Registration number 2089517
- Filing date Aug 2, 1994
- Micro SMT Corporation
- 35 - Advertising

CHIPSCALE, INC

Organization

Patents Grantslast 30 patents

Integrated passive components and package with posts

Integrated passive components and package with posts

Integrated passive components and package with posts

Integrated passive components and package with posts

Wafer fabrication of inside-wrapped contacts for electronic devices

Wafer fabrication of die-bottom contacts for electronic devices

Resistor fabrication

Electronic component package with posts on the active side of the s...

Wafer fabrication of die-bottom contacts for electronic devices

Wafer fabrication of inside-wrapped contacts for electronic devices

Electrical apparatus with a metallic layer coupled to a lower regio...

Method for making a leadless surface mounted device with wrap-aroun...

Fabricating a semiconductor with an insulative coating

Semiconductor fabrication with contact processing for wrap-around f...

Trademarklast 30 trademarks

75274589 - MICROGRID ARRAY

75274233 - UGA

74556225 - MICRO SMT