CHU, JINN P.

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

Information Patent Application
Copper layer and a method for manufacturing said copper layer
- Publication number 20070281457
- Publication date Dec 6, 2007
- Jinn P. CHU
- Jinn P. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper film containing tungsten nitride for improving thermal stabi...
- Publication number 20050252583
- Publication date Nov 17, 2005
- Jinn P. CHU
- Jinn P. Chu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Trademarklast 30 trademarks