CIRCUIT FOIL JAPAN CO., LTD.

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CHIYODA-KU, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil for high-density ultra-fine printed wiring board
- Patent number 7,175,920
- Issue date Feb 13, 2007
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high-density ultrafine printed wiring boad
- Patent number 7,026,059
- Issue date Apr 11, 2006
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board
- Patent number 6,835,442
- Issue date Dec 28, 2004
- Sony Chemicals Corp.
- Noriaki Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for preparing porous electrolytic metal foil
- Patent number 6,153,077
- Issue date Nov 28, 2000
- Circuit Foil Japan Co., Ltd.
- Hitoshi Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil for fine pattern and method for produc...
- Patent number 5,834,140
- Issue date Nov 10, 1998
- Circuit Foil Japan Co., Ltd.
- Adam M. Wolski
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of surface-roughening treatment of copper foil
- Patent number 5,792,333
- Issue date Aug 11, 1998
- Circuit Foil Japan Co., Ltd.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal foil manufacturing method and an anodized film forming appara...
- Patent number 5,441,627
- Issue date Aug 15, 1995
- The Furukawa Electric Co., Ltd.
- Hitoshi Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Both-side roughened copper foil with protection film
- Patent number 5,413,838
- Issue date May 9, 1995
- Sumitomo Bakelite Company Limited
- Keiji Azuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for inner layer circuit of multi-layered printed circui...
- Patent number 5,320,919
- Issue date Jun 14, 1994
- Sumitomo Bakelite Company Limited
- Keiji Azuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing copper-clad laminated board
- Patent number 5,286,330
- Issue date Feb 15, 1994
- Sumitomo Bakelite Company Limited
- Keiji Azuma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

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Patents Applicationslast 30 patents

Information Patent Application
Copper foil for high-density ultra-fine printed wiring board
- Publication number 20050249927
- Publication date Nov 10, 2005
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high-density ultrafine printed wiring boad
- Publication number 20040038049
- Publication date Feb 26, 2004
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

CIRCUIT FOIL JAPAN CO., LTD.

Organization

Patents Grantslast 30 patents

Copper foil for high-density ultra-fine printed wiring board

Copper foil for high-density ultrafine printed wiring boad

Flexible printed wiring board

Process for preparing porous electrolytic metal foil

Electrodeposited copper foil for fine pattern and method for produc...

Method of surface-roughening treatment of copper foil

Metal foil manufacturing method and an anodized film forming appara...

Both-side roughened copper foil with protection film

Copper foil for inner layer circuit of multi-layered printed circui...

Method of producing copper-clad laminated board

Patents Applicationslast 30 patents

Copper foil for high-density ultra-fine printed wiring board

Copper foil for high-density ultrafine printed wiring boad