CMK, INC.

Organization

PORTLAND, OR, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board with built-in semiconductor element, and proce...
- Patent number 8,035,979
- Issue date Oct 11, 2011
- CMK Corporation
- Yutaka Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having adhesion increasing film to prevent pee...
- Patent number 7,910,405
- Issue date Mar 22, 2011
- Casio Computer Co., Ltd.
- Osamu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board with built-in semiconductor element, and proce...
- Patent number 7,894,200
- Issue date Feb 22, 2011
- CMK Corporation
- Yutaka Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor device including forming an i...
- Patent number 7,867,828
- Issue date Jan 11, 2011
- Casio Computer Co., Ltd.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, including connected upper and lower intercon...
- Patent number 7,709,942
- Issue date May 4, 2010
- Casio Computer Co., Ltd.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including connected upper and lower interconn...
- Patent number 7,615,411
- Issue date Nov 10, 2009
- Casio Computer Co., Ltd.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device incorporating a semico...
- Patent number 7,608,480
- Issue date Oct 27, 2009
- Casio Computer Co., Ltd.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a hard sheet to reduce warping of a...
- Patent number 7,489,032
- Issue date Feb 10, 2009
- Casio Computer Co., Ltd.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,445,964
- Issue date Nov 4, 2008
- Casio Computer Co., Ltd.
- Ichiro Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multilayer printed wiring board
- Patent number 7,363,706
- Issue date Apr 29, 2008
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device incorporating a semiconductor constructing bod...
- Patent number 7,279,750
- Issue date Oct 9, 2007
- Casio Computer Co., Ltd.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 7,243,425
- Issue date Jul 17, 2007
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,183,639
- Issue date Feb 27, 2007
- Casio Computer Co., Ltd.
- Ichiro Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal core multilayer printed wiring board
- Patent number 7,087,845
- Issue date Aug 8, 2006
- CMK Corporation
- Hiroshi Tohkairin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having a cover lay laminated on a polyimide re...
- Patent number 5,633,480
- Issue date May 27, 1997
- CMK Corporation
- Hiromoto Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing in which a basefil...
- Patent number 5,629,497
- Issue date May 13, 1997
- CMK Corporation
- Hiromoto Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a printed circuit board
- Patent number 5,377,406
- Issue date Jan 3, 1995
- CMK Corporation
- Masuo Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCE...
- Publication number 20110090657
- Publication date Apr 21, 2011
- CMK CORPORATION
- Yutaka YOSHINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A HARD SHEET TO REDUCE WARPING OF A...
- Publication number 20080014681
- Publication date Jan 17, 2008
- CASIO COMPUTER CO., LTD.
- Hiroyasu JOBETTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a semiconductor device incorporating a semico...
- Publication number 20070264754
- Publication date Nov 15, 2007
- CASIO COMPUTER CO., LTD.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ADHESION INCREASING FILM TO PREVENT PEE...
- Publication number 20070232061
- Publication date Oct 4, 2007
- CASIO COMPUTER CO., LTD.
- Osamu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070099409
- Publication date May 3, 2007
- CASIO COMPUTER CO., LTD.
- Ichiro Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-wiring board, multilayer printed-wiring board and manufactu...
- Publication number 20070074902
- Publication date Apr 5, 2007
- CMK CORPORATION
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20060137906
- Publication date Jun 29, 2006
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and method of manufacturing the same
- Publication number 20060137904
- Publication date Jun 29, 2006
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal core multilayer printed wiring board
- Publication number 20050145414
- Publication date Jul 7, 2005
- CMK Corporation
- Hiroshi Tohkairin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050051886
- Publication date Mar 10, 2005
- CASIO COMPUTER CO., LTD.
- Ichiro Mihara
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
78652425 - CMK COMPANIES
- Serial number 78652425
- Registration number 3123175
- Filing date Jun 16, 2005
- CMK Companies Ltd.
- 37 - Building construction
Information Trademark
73614719 - KING GRABBER
- Serial number 73614719
- Registration number 1438495
- Filing date Aug 14, 1986
- CMK, INC.
- 7 - Machines and machine tools

Organization

Patents Grantslast 30 patents

Printed wiring board with built-in semiconductor element, and proce...

Semiconductor device having adhesion increasing film to prevent pee...

Printed wiring board with built-in semiconductor element, and proce...

Method of fabricating a semiconductor device including forming an i...

Semiconductor package, including connected upper and lower intercon...

Semiconductor package including connected upper and lower interconn...

Method of fabricating a semiconductor device incorporating a semico...

Semiconductor device including a hard sheet to reduce warping of a...

Semiconductor device and method of manufacturing the same

Method of manufacturing a multilayer printed wiring board

Semiconductor device incorporating a semiconductor constructing bod...

Printed wiring board and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Metal core multilayer printed wiring board

Printed wiring board having a cover lay laminated on a polyimide re...

Printed wiring board and method of manufacturing in which a basefil...

Process for producing a printed circuit board

Patents Applicationslast 30 patents

PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCE...

SEMICONDUCTOR DEVICE INCLUDING A HARD SHEET TO REDUCE WARPING OF A...

Method of fabricating a semiconductor device incorporating a semico...

SEMICONDUCTOR DEVICE HAVING ADHESION INCREASING FILM TO PREVENT PEE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Printed-wiring board, multilayer printed-wiring board and manufactu...

Printed wiring board and method of manufacturing the same

Multilayer printed wiring board and method of manufacturing the same

Metal core multilayer printed wiring board

Semiconductor device and method of manufacturing the same

Trademarklast 30 trademarks

78652425 - CMK COMPANIES

73614719 - KING GRABBER