Comchip Technology Co.,Ltd.

Organization

New Taipei City, TW

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing die package structure
- Patent number 11,302,664
- Issue date Apr 12, 2022
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die package structure
- Patent number 11,264,355
- Issue date Mar 1, 2022
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a chip package
- Patent number 10,950,502
- Issue date Mar 16, 2021
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 10,937,760
- Issue date Mar 2, 2021
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a chip package
- Patent number 10,910,268
- Issue date Feb 2, 2021
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 10,777,461
- Issue date Sep 15, 2020
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing chip packages
- Patent number 10,665,509
- Issue date May 26, 2020
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete circuit component having fabrication stage clogged through...
- Patent number 6,989,559
- Issue date Jan 24, 2006
- Comchip Technology Co., Ltd.
- Wen-Long Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete circuit component having an up-right circuit die with late...
- Patent number 6,870,261
- Issue date Mar 22, 2005
- Comchip Technology Co., Ltd.
- Chih-Liang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding method for semiconductor circuit components employing...
- Patent number 6,818,541
- Issue date Nov 16, 2004
- Comchip Technology Co., Ltd.
- Cheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete circuit component and process of fabrication
- Patent number 6,618,269
- Issue date Sep 9, 2003
- Comchip Technology Co., Ltd.
- Wen Long Chen
- H01 - BASIC ELECTRIC ELEMENTS

Please log in for detailed analytics

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING DIE PACKAGE STRUCTURE
- Publication number 20210343672
- Publication date Nov 4, 2021
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DIE PACKAGE STRUCTURE
- Publication number 20210265304
- Publication date Aug 26, 2021
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20200235009
- Publication date Jul 23, 2020
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CHIP PACKAGE
- Publication number 20200161182
- Publication date May 21, 2020
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CHIP PACKAGE
- Publication number 20200161183
- Publication date May 21, 2020
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20200105714
- Publication date Apr 2, 2020
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CHIP PACKAGES
- Publication number 20200105601
- Publication date Apr 2, 2020
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discrete circuit component and process of fabrication
- Publication number 20020162686
- Publication date Nov 7, 2002
- Comchip Technology Co., Ltd.
- Wen Long Chen
- H01 - BASIC ELECTRIC ELEMENTS

Please log in for detailed analytics

Trademarklast 30 trademarks

Information Trademark
90680078 - COMCHIP SMD DIODE SPECIALIST
- Serial number 90680078
- Registration number 7051554
- Filing date Apr 29, 2021
- COMCHIP TECHNOLOGY CO., LTD.
- 7 - Machines and machine tools

Comchip Technology Co.,Ltd.

Organization

Patents Grantslast 30 patents

Method of manufacturing die package structure

Method of manufacturing die package structure

Method of manufacturing a chip package

Method for manufacturing a chip package

Method of manufacturing a chip package

Method for manufacturing a chip package

Method for manufacturing chip packages

Discrete circuit component having fabrication stage clogged through...

Discrete circuit component having an up-right circuit die with late...

Metal bonding method for semiconductor circuit components employing...

Discrete circuit component and process of fabrication

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING DIE PACKAGE STRUCTURE

METHOD OF MANUFACTURING DIE PACKAGE STRUCTURE

METHOD FOR MANUFACTURING A CHIP PACKAGE

METHOD OF MANUFACTURING A CHIP PACKAGE

METHOD OF MANUFACTURING A CHIP PACKAGE

METHOD FOR MANUFACTURING A CHIP PACKAGE

METHOD FOR MANUFACTURING CHIP PACKAGES

Discrete circuit component and process of fabrication

Trademarklast 30 trademarks

90680078 - COMCHIP SMD DIODE SPECIALIST