COMPEQ MANUFACTURING CO., LTD.

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TAOYUAN HSIEN, R.O.C., TW

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of heat dissipation component
- Patent number 11,183,442
- Issue date Nov 23, 2021
- COMPEQ MANUFACTURING CO., LTD.
- Sz-Shian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making rigid-flexible printed circuit board having a peel...
- Patent number 8,033,013
- Issue date Oct 11, 2011
- Compeq Manufacturing Co., Ltd.
- Yen Ching Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board carrier
- Patent number 7,891,502
- Issue date Feb 22, 2011
- Compeq Manufacturing Company Limited
- Wei-Lieh Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming heightened solder bumps on circuit boards
- Patent number 6,979,636
- Issue date Dec 27, 2005
- Compeq Manufacturing Co., Ltd.
- Cheng-Yuan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having jumper lines and the method for making...
- Patent number 6,753,746
- Issue date Jun 22, 2004
- Compeq Manufacturing Co., Ltd.
- Wen-Yen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste stenciling apparatus for minimizing residue of solder...
- Patent number 6,675,704
- Issue date Jan 13, 2004
- Compeq Manufacturing Company Limited
- Cheng-Yuan Lin
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Detecting structure formed on a PCB to detect unavailability of the...
- Patent number 6,639,396
- Issue date Oct 28, 2003
- Compeq Manufacturing Company Limited
- Ching-Chin Lin
- G01 - MEASURING TESTING
Information Patent Grant
Positioning target for laminated printed circuit board
- Patent number 6,585,024
- Issue date Jul 1, 2003
- Compeq Manufacturing Company Limited
- Hsien-Yu Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for determining the compensation value of the width of a wir...
- Patent number 6,295,631
- Issue date Sep 25, 2001
- Compeq Manufacturing Company Limited
- Wen-Yen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat, built-in resistors and capacitors for a printed circuit board
- Patent number 6,278,356
- Issue date Aug 21, 2001
- Compeq Manufacturing Company Limited
- Wen-Yen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for packaging an integrated circuit with readi...
- Patent number 6,057,179
- Issue date May 2, 2000
- Compeq Manufacturing Company Limited
- Wen-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer flat type ball grid array method for manufacturing packagi...
- Patent number 5,884,396
- Issue date Mar 23, 1999
- Compeq Manufacturing Company, Limited
- Ting-hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array packaging method for an integrated circuit and stru...
- Patent number 5,882,957
- Issue date Mar 16, 1999
- Compeq Manufacturing Company Limited
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging tab-BGA integrated circuits
- Patent number 5,843,806
- Issue date Dec 1, 1998
- Compeq Manufacturing Company Limited
- Wei-Jen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method for a ball grid array integrated circuit without u...
- Patent number 5,830,800
- Issue date Nov 3, 1998
- Compeq Manufacturing Company Ltd.
- Ting-hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid tape automated bonding packaging method
- Patent number 5,763,294
- Issue date Jun 9, 1998
- Compeq Manufacturing Company Limited
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding copper and resin
- Patent number 5,147,492
- Issue date Sep 15, 1992
- Compeq Manufacturing Co., Ltd.
- Chung J. Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for producing copper sulfate from waste copper-containing li...
- Patent number 5,059,403
- Issue date Oct 22, 1991
- Compeq Manufacturing Co., Ltd.
- Chung C. Chen
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method of bonding copper and resin
- Patent number 5,006,200
- Issue date Apr 9, 1991
- Compeq Manufacturing Co., Ltd.
- C. J. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF HEAT DISSIPATION COMPONENT
- Publication number 20210005530
- Publication date Jan 7, 2021
- COMPEQ MANUFACTURING CO., LTD.
- Sz-Shian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board carrier
- Publication number 20100122959
- Publication date May 20, 2010
- Compeq Manufacturing Company Limited
- Wei-Lieh Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD HAVING A PEELABLE MASK AND MET...
- Publication number 20090321112
- Publication date Dec 31, 2009
- Compeq Manufacturing Co., Ltd.
- Yen Ching Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board with grounding grids and method for contro...
- Publication number 20070227762
- Publication date Oct 4, 2007
- Compeq Manufacturing Company Limited
- Wilson Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating resistors on a printed circuit board
- Publication number 20030194655
- Publication date Oct 16, 2003
- Compeq Manufacturing Company Limited
- Wen-Long Jong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricting a resistor on a printed circuit board
- Publication number 20030194845
- Publication date Oct 16, 2003
- Compeq Manufacturing Company Limited
- Wen-Long Jong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming large integration and ultra-fine lines on a subs...
- Publication number 20030029832
- Publication date Feb 13, 2003
- Compeq Manufacturing Company Limited
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making holes in a substrate
- Publication number 20020070204
- Publication date Jun 13, 2002
- Compeq Manufacturing Co., Ltd.
- Guan-Po Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making a planar inductor/transformer in a laminated prin...
- Publication number 20020002771
- Publication date Jan 10, 2002
- Compeq Manufacturing Company Limited
- Wen-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
76445900 - COMPEQ
- Serial number 76445900
- Registration number 2752450
- Filing date Aug 29, 2002
- COMPEQ MANUFACTURING CO., LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
73641701 - COMPEQ
- Serial number 73641701
- Filing date Jan 28, 1987
- COMPEQ MANUFACTURING CO., LTD.
- 35 - Advertising
Information Trademark
73510695 - COMPEQ
- Serial number 73510695
- Registration number 1345864
- Filing date Nov 27, 1984
- COMPEQ MANUFACTURING CO., LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

COMPEQ MANUFACTURING CO., LTD.

Organization

Patents Grantslast 30 patents

Manufacturing method of heat dissipation component

Method of making rigid-flexible printed circuit board having a peel...

Circuit board carrier

Method for forming heightened solder bumps on circuit boards

Printed circuit board having jumper lines and the method for making...

Solder paste stenciling apparatus for minimizing residue of solder...

Detecting structure formed on a PCB to detect unavailability of the...

Positioning target for laminated printed circuit board

Method for determining the compensation value of the width of a wir...

Flat, built-in resistors and capacitors for a printed circuit board

Method and structure for packaging an integrated circuit with readi...

Transfer flat type ball grid array method for manufacturing packagi...

Ball grid array packaging method for an integrated circuit and stru...

Methods for packaging tab-BGA integrated circuits

Packaging method for a ball grid array integrated circuit without u...

Solid tape automated bonding packaging method

Method of bonding copper and resin

Method for producing copper sulfate from waste copper-containing li...

Method of bonding copper and resin

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF HEAT DISSIPATION COMPONENT

Circuit board carrier

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD HAVING A PEELABLE MASK AND MET...

Multilayer circuit board with grounding grids and method for contro...

Method for fabricating resistors on a printed circuit board

Method for fabricting a resistor on a printed circuit board

Method for forming large integration and ultra-fine lines on a subs...

Method for making holes in a substrate

Method for making a planar inductor/transformer in a laminated prin...

Trademarklast 30 trademarks

76445900 - COMPEQ

73641701 - COMPEQ

73510695 - COMPEQ