COOKSON ELECTRONICS ASSEMBLY MATERIALS GROUP ALPHA

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  • SOMERSET, NJ, US

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  • Information Patent Application

    SOLDERING MATERIAL BASED ON SN AG AND CU

    • Publication number 20200023472
    • Publication date Jan 23, 2020
    • Henkel AG & Co. KGaA
    • Hans-Jurgen Albrecht
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

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