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COOKSON ELECTRONICS ASSEMBLY MATERIALS GROUP ALPHA
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SOMERSET, NJ, US
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Patent Application
SOLDERING MATERIAL BASED ON SN AG AND CU
Publication number
20200023472
Publication date
Jan 23, 2020
Henkel AG & Co. KGaA
Hans-Jurgen Albrecht
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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