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COOKSON SINGAPORE PTE LTD

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  • JERSEY CITY, NJ, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Hardener for epoxy molding compounds
    • Patent number 6,437,026
    • Issue date Aug 20, 2002
    • Cookson Singapore PTE Ltd.
    • David William Garrett
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Epoxy mold compound and method
    • Patent number 6,214,905
    • Issue date Apr 10, 2001
    • Cookson Singapore PTE LTD c/o Alpha Metals, Inc.
    • David William Garrett
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents