Cypess Semiconductor Corporation

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package assembly with improved bond wire separation
- Patent number 9,431,364
- Issue date Aug 30, 2016
- Cypess Semiconductor Corporation
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure for stacked-type semiconductor device, method of...
- Patent number 9,142,440
- Issue date Sep 22, 2015
- Cypess Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS

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