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DDCIP TECHNOLOGIES, INC

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  • SUGAR LAND, TX, US
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Patents Applicationslast 30 patents

  • Information Patent Application

    HEAT DISSIPATION ASSEMBLY
    • Publication number 20080037222
    • Publication date Feb 14, 2008
    • DDCIP Technologies, Inc.
    • Vikas Jha
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR