DECA TECHNOLOGIES INC.

Organization

George Town, KY

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Fully molded semiconductor package for power devices and method of...
- Patent number 10,818,635
- Issue date Oct 27, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced fully molded fan-out module
- Patent number 10,720,417
- Issue date Jul 21, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of unit specific progressive alignment
- Patent number 10,573,601
- Issue date Feb 25, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of packaging
- Patent number 10,373,870
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of marking a semiconductor package
- Patent number 10,373,913
- Issue date Aug 6, 2019
- Deca Technologies, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 10,373,902
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two step method of rapid curing a semiconductor polymer layer
- Patent number 10,204,803
- Issue date Feb 12, 2019
- Deca Technologies Inc.
- William Boyd Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of unit specific progressive alignment
- Patent number 10,157,803
- Issue date Dec 18, 2018
- Deca Technologies Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 10,056,304
- Issue date Aug 21, 2018
- Deca Technologies Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fully molded peripheral package on package device
- Patent number 10,050,004
- Issue date Aug 14, 2018
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,978,655
- Issue date May 22, 2018
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,887,103
- Issue date Feb 6, 2018
- Deca Technologies, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 9,831,170
- Issue date Nov 28, 2017
- Deca Technologies, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package comprising unit specific alignment and unit speci...
- Patent number 9,818,659
- Issue date Nov 14, 2017
- Deca Technologies Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced fully molded fan-out module
- Patent number 9,761,571
- Issue date Sep 12, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method comprising redistribution layers
- Patent number 9,754,835
- Issue date Sep 5, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated shielding for wafer plating
- Patent number 9,653,339
- Issue date May 16, 2017
- Deca Technologies Inc.
- Tim Olson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 9,640,495
- Issue date May 2, 2017
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of marking a semiconductor package
- Patent number 9,613,912
- Issue date Apr 4, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded peripheral package on package device
- Patent number 9,613,830
- Issue date Apr 4, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method comprising redistribution layers
- Patent number 9,576,919
- Issue date Feb 21, 2017
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front side package-level serialization for packages comprising uniq...
- Patent number 9,520,364
- Issue date Dec 13, 2016
- Deca Technologies Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive patterning for panelized packaging
- Patent number 9,520,331
- Issue date Dec 13, 2016
- Deca Technologies Inc.
- Christopher M. Scanlan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D interconnect component for fully molded packages
- Patent number 9,502,397
- Issue date Nov 22, 2016
- Deca Technologies, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically sealed wafer plating jig system and method
- Patent number 9,464,362
- Issue date Oct 11, 2016
- Deca Technologies Inc.
- Christopher M. Scanlan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adaptive patterning for panelized packaging
- Patent number 9,418,905
- Issue date Aug 16, 2016
- Deca Technologies Inc.
- Timothy L. Olson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 9,401,313
- Issue date Jul 26, 2016
- Deca Technologies, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,397,069
- Issue date Jul 19, 2016
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERC...
- Publication number 20200402941
- Publication date Dec 24, 2020
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR PACKAGE FOR POWER DEVICES AND METHOD OF...
- Publication number 20190326255
- Publication date Oct 24, 2019
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT
- Publication number 20190139901
- Publication date May 9, 2019
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20180330966
- Publication date Nov 15, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE
- Publication number 20180261586
- Publication date Sep 13, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING
- Publication number 20180254216
- Publication date Sep 6, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT
- Publication number 20180082911
- Publication date Mar 22, 2018
- DECA TECHNOLOGIES INC
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE
- Publication number 20180012881
- Publication date Jan 11, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
- Publication number 20170372964
- Publication date Dec 28, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
- Publication number 20170256466
- Publication date Sep 7, 2017
- DECA TECHNOLOGIES INC
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
- Publication number 20170221719
- Publication date Aug 3, 2017
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20170221830
- Publication date Aug 3, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MARKING A SEMICONDUCTOR PACKAGE
- Publication number 20170186696
- Publication date Jun 29, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20170148755
- Publication date May 25, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE COMPRISING UNIT SPECIFIC ALIGNMENT AND UNIT SPECI...
- Publication number 20170103927
- Publication date Apr 13, 2017
- DECA TECHNOLOGIES INC
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE
- Publication number 20170084596
- Publication date Mar 23, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20170077022
- Publication date Mar 16, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
- Publication number 20170033009
- Publication date Feb 2, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
- Publication number 20170012009
- Publication date Jan 12, 2017
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
- Publication number 20160336241
- Publication date Nov 17, 2016
- DECA TECHNOLOGIES INC
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...
- Publication number 20160329257
- Publication date Nov 10, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT COMPONENT FOR FULLY MOLDED PACKAGES
- Publication number 20160322343
- Publication date Nov 3, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20160260682
- Publication date Sep 8, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MARKING A SEMICONDUCTOR PACKAGE
- Publication number 20160172306
- Publication date Jun 16, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
- Publication number 20160141213
- Publication date May 19, 2016
- DECA TECHNOLOGIES INC
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
- Publication number 20160093580
- Publication date Mar 31, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...
- Publication number 20160086825
- Publication date Mar 24, 2016
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE PACKAGE-LEVEL SERIALIZATION FOR PACKAGES COMPRISING UNIQ...
- Publication number 20160064334
- Publication date Mar 3, 2016
- DECA TECHNOLOGIES INC
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER
- Publication number 20160027666
- Publication date Jan 28, 2016
- DECA TECHNOLOGIES INC
- William Boyd Rogers
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
90343001 - APDK
- Serial number 90343001
- Filing date Nov 25, 2020
- Deca Technologies Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
85639524 - DECA TECHNOLOGIES
- Serial number 85639524
- Registration number 4491815
- Filing date May 31, 2012
- Deca Technologies, Inc.
- 40 - Treatment of materials
Information Trademark
85539076 - AP ADAPTIVE PATTERNING
- Serial number 85539076
- Registration number 4656598
- Filing date Feb 10, 2012
- Deca Technologies, Inc.
- 40 - Treatment of materials
Information Trademark
77898168 - DECATECH
- Serial number 77898168
- Filing date Dec 21, 2009
- Deca Technologies, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

DECA TECHNOLOGIES INC.

Organization

Patents Grantslast 30 patents

Fully molded semiconductor package for power devices and method of...

Thermally enhanced fully molded fan-out module

Method of making fully molded peripheral package on package device

Semiconductor device processing method for material removal

Semiconductor device and method of unit specific progressive alignment

Semiconductor device and method of packaging

Method of marking a semiconductor package

Fully molded miniaturized semiconductor module

Two step method of rapid curing a semiconductor polymer layer

Semiconductor device and method of unit specific progressive alignment

Automated optical inspection of unit specific patterning

Fully molded peripheral package on package device

Semiconductor device and method of adaptive patterning for panelize...

Semiconductor device and method of adaptive patterning for panelize...

Fully molded miniaturized semiconductor module

Multi-die package comprising unit specific alignment and unit speci...

Thermally enhanced fully molded fan-out module

Semiconductor device and method comprising redistribution layers

Integrated shielding for wafer plating

Semiconductor device processing method for material removal

Method of marking a semiconductor package

Fully molded peripheral package on package device

Semiconductor device and method comprising redistribution layers

Front side package-level serialization for packages comprising uniq...

Adaptive patterning for panelized packaging

3D interconnect component for fully molded packages

Magnetically sealed wafer plating jig system and method

Adaptive patterning for panelized packaging

Automated optical inspection of unit specific patterning

Semiconductor device and method of adaptive patterning for panelize...

Patents Applicationslast 30 patents

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERC...

FULLY MOLDED SEMICONDUCTOR PACKAGE FOR POWER DEVICES AND METHOD OF...

SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT

THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE

SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS

AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING

SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

METHOD OF MARKING A SEMICONDUCTOR PACKAGE

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

MULTI-DIE PACKAGE COMPRISING UNIT SPECIFIC ALIGNMENT AND UNIT SPECI...

THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL

AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING

SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...

3D INTERCONNECT COMPONENT FOR FULLY MOLDED PACKAGES

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

METHOD OF MARKING A SEMICONDUCTOR PACKAGE

AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING

SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...

FRONT SIDE PACKAGE-LEVEL SERIALIZATION FOR PACKAGES COMPRISING UNIQ...

TWO STEP METHOD OF RAPID CURING A SEMICONDUCTOR POLYMER LAYER

Trademarklast 30 trademarks

90343001 - APDK

85639524 - DECA TECHNOLOGIES

85539076 - AP ADAPTIVE PATTERNING

77898168 - DECATECH