DISCO ABRASIVE SYSTEMS, LTD.

Organization

TOKYO, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for grinding the surface of a semiconductor wafer
- Patent number 4,947,598
- Issue date Aug 14, 1990
- Disco Abrasive Systems, Ltd.
- Mitsuo Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Cutter
- Patent number 4,872,289
- Issue date Oct 10, 1989
- Disco Abrasive Systems, Ltd.
- Isao Yukawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting tool having concentrically arranged outside and inside abra...
- Patent number 4,843,766
- Issue date Jul 4, 1989
- Disco Abrasive Systems, Ltd.
- Yoshio Umeda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for machining hard, brittle and difficultly-ma...
- Patent number 4,839,996
- Issue date Jun 20, 1989
- Disco Abrasive Systems, Ltd.
- Shinji Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Cutting tool having concentrically arranged outside and inside abra...
- Patent number 4,817,341
- Issue date Apr 4, 1989
- Disco Abrasive Systems, Ltd.
- Yoshio Umeda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Automatic accurate alignment system
- Patent number 4,757,550
- Issue date Jul 12, 1988
- Disco Abrasive Systems, Ltd.
- Masanori Uga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for grinding the surface of a semiconductor
- Patent number 4,753,049
- Issue date Jun 28, 1988
- Disco Abrasive Systems, Ltd.
- Toshiyuki Mori
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic accurate alignment system
- Patent number 4,720,635
- Issue date Jan 19, 1988
- Disco Abrasive Systems, Ltd.
- Masanori Uga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision device for reducing errors attributed to temperature chan...
- Patent number 4,705,016
- Issue date Nov 10, 1987
- Disco Abrasive Systems, Ltd.
- Shinji Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer mounting and cutting system
- Patent number 4,696,712
- Issue date Sep 29, 1987
- Disco Abrasive Systems, Ltd.
- Yuzo Nonaka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor wafer surface grinding apparatus
- Patent number 4,693,036
- Issue date Sep 15, 1987
- Disco Abrasive Systems, Ltd.
- Toshiyuki Mori
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer dicing machine
- Patent number 4,688,540
- Issue date Aug 25, 1987
- Disco Abrasive Systems, Ltd.
- Takatoshi Ono
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Automatic accurate alignment system
- Patent number 4,672,557
- Issue date Jun 9, 1987
- Disco Abrasive Systems, Ltd.
- Shinichi Tamura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Article holding apparatus and its use
- Patent number 4,652,135
- Issue date Mar 24, 1987
- Disco Abrasive Systems, Ltd.
- Takatoshi Ono
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for cutting a sheet-like member applied to a surface of a...
- Patent number 4,603,609
- Issue date Aug 5, 1986
- Disco Abrasive Systems, Ltd.
- Ono Takatoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding machine
- Patent number 4,583,325
- Issue date Apr 22, 1986
- Fujitsu Limited
- Shuji Tabuchi
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding and/or cutting endless belt
- Patent number 4,565,034
- Issue date Jan 21, 1986
- Disco Abrasive Systems, Ltd.
- Shinji Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Machining device equipped with blade inspecting means
- Patent number 4,558,686
- Issue date Dec 17, 1985
- Disco Abrasive Systems, Ltd.
- Takatoshi Ono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited grinding tool
- Patent number 4,547,998
- Issue date Oct 22, 1985
- Disco Abrasive Systems, Ltd.
- Keiichi Kajiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Grinding machine
- Patent number 4,481,738
- Issue date Nov 13, 1984
- Fujitsu Limited
- Shuji Tabuchi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

Information Trademark
73704265 - DISCO
- Serial number 73704265
- Registration number 1572896
- Filing date Jan 5, 1988
- DISCO ABRASIVE SYSTEMS, LTD.
- 7 - Machines and machine tools

DISCO ABRASIVE SYSTEMS, LTD.

Organization

Patents Grantslast 30 patents

Method for grinding the surface of a semiconductor wafer

Cutter

Cutting tool having concentrically arranged outside and inside abra...

Method and apparatus for machining hard, brittle and difficultly-ma...

Cutting tool having concentrically arranged outside and inside abra...

Automatic accurate alignment system

Method and apparatus for grinding the surface of a semiconductor

Automatic accurate alignment system

Precision device for reducing errors attributed to temperature chan...

Semiconductor wafer mounting and cutting system

Semiconductor wafer surface grinding apparatus

Semiconductor wafer dicing machine

Automatic accurate alignment system

Article holding apparatus and its use

Apparatus for cutting a sheet-like member applied to a surface of a...

Grinding machine

Grinding and/or cutting endless belt

Machining device equipped with blade inspecting means

Electrodeposited grinding tool

Grinding machine

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

73704265 - DISCO