DONGGUAN CHINA ADVANCED CERAMIC TECHNOLOGY CO., LTD

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DONGGUAN CITY, CN

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic module for power semiconductor integrated packaging and pre...
- Patent number 10,461,016
- Issue date Oct 29, 2019
- DONGGUAN CHINA ADVANCED CERAMIC TECHNOLOGY CO., LTD.
- Zhaohui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing ceramic package substrate with copper-plated dam
- Patent number 10,297,498
- Issue date May 21, 2019
- DONGGUAN CHINA ADVANCED CERAMIC TECHNOLOGY CO., LTD.
- Zhaohui Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC MODULE FOR POWER SEMICONDUCTOR INTEGRATED PACKAGING AND PRE...
- Publication number 20190103336
- Publication date Apr 4, 2019
- Dongguan China Advanced Ceramic Technology Co., Ltd.
- Zhaohui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC MODULE FOR POWER SEMICONDUCTOR INTEGRATED PACKAGING AND PRE...
- Publication number 20190019740
- Publication date Jan 17, 2019
- Dongguan China Advanced Ceramic Technology Co., Ltd.
- Zhaohui Wu
- H01 - BASIC ELECTRIC ELEMENTS

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