DOWA METALTECH CO., LTD.

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper alloy plate and method for producing same
- Patent number 12,049,690
- Issue date Jul 30, 2024
- Dowa Metaltech Co., Ltd.
- Kazuki Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cu—Ti-based copper alloy sheet material, method for producing the s...
- Patent number 11,946,127
- Issue date Apr 2, 2024
- Dowa Metaltech Co., Ltd.
- Takuya Hashimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cu—Ni—Al based copper alloy sheet material, method for producing sa...
- Patent number 11,946,129
- Issue date Apr 2, 2024
- Dowa Metaltech Co., Ltd.
- Toshiya Shutoh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite plating material and method for producing the same
- Patent number 11,926,917
- Issue date Mar 12, 2024
- Dowa Metaltech Co., Ltd.
- Yukiya Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite plated product and method for producing same
- Patent number 11,920,255
- Issue date Mar 5, 2024
- Dowa Metaltech Co., Ltd.
- Hirotaka Kotani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing heat radiation member
- Patent number 11,919,288
- Issue date Mar 5, 2024
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Plated product and method for producing same
- Patent number 11,898,263
- Issue date Feb 13, 2024
- Dowa Metaltech Co., Ltd.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing insulated circuit board using a mask and parti...
- Patent number 11,761,108
- Issue date Sep 19, 2023
- Dowa Metaltech Co., Ltd.
- Masaaki Higo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 11,749,581
- Issue date Sep 5, 2023
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy plate and method for producing same
- Patent number 11,591,673
- Issue date Feb 28, 2023
- Dowa Metaltech Co., Ltd.
- Naota Higami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cu—Co—Si-based copper alloy sheet material and method for producing...
- Patent number 11,332,815
- Issue date May 17, 2022
- Dowa Metaltech Co., Ltd.
- Hiroshi Hyodo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Sheet matertal of copper alloy and method for producing same
- Patent number 11,293,084
- Issue date Apr 5, 2022
- Dowa Metaltech Co., Ltd.
- Naota Higami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat sink plate
- Patent number 11,285,701
- Issue date Mar 29, 2022
- THEGOODSYSTEM CORP.
- Meoung-whan Cho
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite plated product and method for producing same
- Patent number 11,225,726
- Issue date Jan 18, 2022
- Dowa Metaltech Co., Ltd.
- Tsuyoshi Ito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite plated product and method for producing same
- Patent number 11,208,730
- Issue date Dec 28, 2021
- Dowa Metaltech Co., Ltd.
- Yuta Sonoda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Heat radiating plate and method for producing same
- Patent number 11,162,745
- Issue date Nov 2, 2021
- Dowa Metaltech Co., Ltd.
- Satoru Ideguchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Silver-plated product and method for producing same
- Patent number 11,142,839
- Issue date Oct 12, 2021
- Dowa Metaltech Co., Ltd.
- Shunki Sadamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 11,078,587
- Issue date Aug 3, 2021
- Dowa Metaltech Co., Ltd.
- Yuta Sonoda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cu-Ni-Si based copper alloy sheet material and production method
- Patent number 11,047,023
- Issue date Jun 29, 2021
- Dowa Metaltech Co., Ltd.
- Toshiya Shutoh
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,982,345
- Issue date Apr 20, 2021
- Dowa Metaltech Co., Ltd.
- Hirotaka Kotani
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,985,485
- Issue date Apr 20, 2021
- Dowa Metaltech Co., Ltd.
- Hiroto Narieda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper alloy sheet material and current-carrying component
- Patent number 10,844,468
- Issue date Nov 24, 2020
- Dowa Metaltech Co., Ltd.
- Kuniaki Miyagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,829,862
- Issue date Nov 10, 2020
- Dowa Metaltech Co., Ltd.
- Tatsunori Murata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Producing metal/ceramic circuit board by removing residual silver
- Patent number 10,834,823
- Issue date Nov 10, 2020
- Dowa Metaltech Co., Ltd.
- Takashi Ideno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper alloy sheet material
- Patent number 10,745,787
- Issue date Aug 18, 2020
- Dowa Metaltech Co., Ltd.
- Tsuyoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,676,835
- Issue date Jun 9, 2020
- Dowa Metaltech Co., Ltd.
- Hirotaka Kotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat radiating plate with supporting members and protrusion members
- Patent number 10,619,948
- Issue date Apr 14, 2020
- Dowa Metaltech Co., Ltd.
- Satoru Ideguchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Silver-plated product and method for producing same
- Patent number 10,597,791
- Issue date Mar 24, 2020
- Dowa Metaltech Co., Ltd.
- Shunki Sadamori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 10,510,557
- Issue date Dec 17, 2019
- Dowa Metaltech Co., Ltd.
- Naoya Sunachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver-plated product and method for producing same
- Patent number 10,501,858
- Issue date Dec 10, 2019
- Dowa Metaltech Co., Ltd.
- Shunki Sadamori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

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Patents Applicationslast 30 patents

Information Patent Application
SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20240287697
- Publication date Aug 29, 2024
- DOWA METALTECH CO., LTD.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE MATERIAL, METHOD FOR MANUFACTURING COMPOSITE MATERIAL, TE...
- Publication number 20240287699
- Publication date Aug 29, 2024
- DOWA METALTECH CO., LTD.
- Hirotaka KOTANI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240234240
- Publication date Jul 11, 2024
- DOWA METALTECH CO., LTD.
- Koji KOBAYASHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE COPPER ALL...
- Publication number 20240200169
- Publication date Jun 20, 2024
- DOWA METALTECH CO., LTD.
- Ryosuke MIYAHARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240136249
- Publication date Apr 25, 2024
- DOWA METALTECH CO., LTD.
- Koji KOBAYASHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
AG-PLATED MATERIAL, METHOD FOR PRODUCING AG-PLATED MATERIAL, AND EL...
- Publication number 20240026558
- Publication date Jan 25, 2024
- DOWA METALTECH CO., LTD.
- Yosuke Sato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AG-COATED MATERIAL, METHOD FOR PRODUCING AG-COATED MATERIAL, AND TE...
- Publication number 20240018680
- Publication date Jan 18, 2024
- DOWA METALTECH CO., LTD.
- Yosuke Sato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cu-Ti-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING THE S...
- Publication number 20230313343
- Publication date Oct 5, 2023
- DOWA METALTECH CO., LTD.
- Takuya Hashimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20230313402
- Publication date Oct 5, 2023
- DOWA METALTECH CO., LTD.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230298961
- Publication date Sep 21, 2023
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu-Ni-Al-BASED COPPER ALLOY PLATE MATERIAL, METHOD FOR MANUFACTURIN...
- Publication number 20230265543
- Publication date Aug 24, 2023
- DOWA METALTECH CO., LTD.
- Shuhei KASATANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268245
- Publication date Aug 24, 2023
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE MATERIAL, METHOD FOR PRODUCING COMPOSITE MATERIAL, AND TE...
- Publication number 20230175160
- Publication date Jun 8, 2023
- DOWA METALTECH CO., LTD.
- Yukiya KATO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-PLATED MEMBER, METHOD FOR PRODUCING THE SAME, AND TERMINAL C...
- Publication number 20230142395
- Publication date May 11, 2023
- DOWA METALTECH CO., LTD.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20230097787
- Publication date Mar 30, 2023
- DOWA METALTECH CO., LTD.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20230093655
- Publication date Mar 23, 2023
- DOWA METALTECH CO., LTD.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BRAZING MATERIAL, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRO...
- Publication number 20230068210
- Publication date Mar 2, 2023
- DOWA METALTECH CO., LTD.
- Ayumu OZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME
- Publication number 20230046780
- Publication date Feb 16, 2023
- DOWA METALTECH CO., LTD.
- Yukiya Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cu-Ni-Si-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SA...
- Publication number 20230018758
- Publication date Jan 19, 2023
- DOWA METALTECH CO., LTD.
- Wanqing JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220367316
- Publication date Nov 17, 2022
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20220259753
- Publication date Aug 18, 2022
- DOWA METALTECH CO., LTD.
- Hirotaka Kotani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY PLATE AND METHOD FOR PRODUCUING SAME
- Publication number 20220162734
- Publication date May 26, 2022
- DOWA METALTECH CO., LTD.
- Kazuki Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20220136122
- Publication date May 5, 2022
- DOWA METALTECH CO., LTD.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MASK FOR PARTIAL PLATING, AND METHOD FOR PRODUCING INSULATED CIRCUI...
- Publication number 20220136126
- Publication date May 5, 2022
- DOWA METALTECH CO., LTD.
- Masaaki Higo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HEAT RADIATION MEMBER AND METHOD FOR PRODUCING SAME
- Publication number 20220080704
- Publication date Mar 17, 2022
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220032580
- Publication date Feb 3, 2022
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220033317
- Publication date Feb 3, 2022
- DOWA METALTECH CO, LTD.
- Koji Kobayashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu-Ni-Al BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SA...
- Publication number 20210238724
- Publication date Aug 5, 2021
- DOWA METALTECH CO., LTD.
- Toshiya SHUTOH
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME
- Publication number 20200407824
- Publication date Dec 31, 2020
- DOWA METALTECH CO., LTD.
- Naota Higami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200388553
- Publication date Dec 10, 2020
- FUJI ELECTRIC CO., LTD.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
97454445 - SILC PLATING
- Serial number 97454445
- Filing date Jun 12, 2022
- DOWA METALTECH CO., LTD.
- 6 - Common metals and their alloys
Information Trademark
97418977 - DCNA
- Serial number 97418977
- Registration number 7477599
- Filing date May 19, 2022
- DOWA METALTECH CO., LTD.
- 6 - Common metals and their alloys

DOWA METALTECH CO., LTD.

Organization

Patents Grantslast 30 patents

Copper alloy plate and method for producing same

Cu—Ti-based copper alloy sheet material, method for producing the s...

Cu—Ni—Al based copper alloy sheet material, method for producing sa...

Composite plating material and method for producing the same

Composite plated product and method for producing same

Method for producing heat radiation member

Plated product and method for producing same

Method for producing insulated circuit board using a mask and parti...

Semiconductor module and method for manufacturing same

Copper alloy plate and method for producing same

Cu—Co—Si-based copper alloy sheet material and method for producing...

Sheet matertal of copper alloy and method for producing same

Heat sink plate

Composite plated product and method for producing same

Composite plated product and method for producing same

Heat radiating plate and method for producing same

Silver-plated product and method for producing same

Tin-plated product and method for producing same

Cu-Ni-Si based copper alloy sheet material and production method

Tin-plated product and method for producing same

Tin-plated product and method for producing same

Copper alloy sheet material and current-carrying component

Tin-plated product and method for producing same

Producing metal/ceramic circuit board by removing residual silver

Copper alloy sheet material

Tin-plated product and method for producing same

Heat radiating plate with supporting members and protrusion members

Silver-plated product and method for producing same

Electronic part mounting substrate and method for producing same

Silver-plated product and method for producing same

Patents Applicationslast 30 patents

SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

COMPOSITE MATERIAL, METHOD FOR MANUFACTURING COMPOSITE MATERIAL, TE...

ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...

COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE COPPER ALL...

ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE...

AG-PLATED MATERIAL, METHOD FOR PRODUCING AG-PLATED MATERIAL, AND EL...

AG-COATED MATERIAL, METHOD FOR PRODUCING AG-COATED MATERIAL, AND TE...

Cu-Ti-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING THE S...

SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

Cu-Ni-Al-BASED COPPER ALLOY PLATE MATERIAL, METHOD FOR MANUFACTURIN...

INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

COMPOSITE MATERIAL, METHOD FOR PRODUCING COMPOSITE MATERIAL, AND TE...

SILVER-PLATED MEMBER, METHOD FOR PRODUCING THE SAME, AND TERMINAL C...

SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

BRAZING MATERIAL, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRO...

COMPOSITE PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME

Cu-Ni-Si-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SA...

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME

COPPER ALLOY PLATE AND METHOD FOR PRODUCUING SAME

PLATED PRODUCT AND METHOD FOR PRODUCING SAME

MASK FOR PARTIAL PLATING, AND METHOD FOR PRODUCING INSULATED CIRCUI...

HEAT RADIATION MEMBER AND METHOD FOR PRODUCING SAME

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

Cu-Ni-Al BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SA...

COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

Trademarklast 30 trademarks

97454445 - SILC PLATING

97418977 - DCNA