DUKSAN HI-METAL CO., LTD.

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Ulsan, KR

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Patents Grantslast 30 patents

Information Patent Grant
Metal core solder ball and heat dissipation structure for semicondu...
- Patent number 10,661,394
- Issue date May 26, 2020
- Duksan Hi-Metal Co., Ltd.
- Yong Cheol Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing metal nanowire and light-transmitting elect...
- Patent number 10,651,414
- Issue date May 12, 2020
- Duksan Hi-Metal Co., Ltd.
- Young Zo Yoo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Metal nanowire and light-transmitting electrode and organic light-e...
- Patent number 10,636,994
- Issue date Apr 28, 2020
- Duksan Hi-Metal Co., Ltd.
- Young Zo Yoo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Core-shell nanowire, method for synthesizing the core-shell nanowir...
- Patent number 10,629,838
- Issue date Apr 21, 2020
- Duksan Hi-Metal Co., Ltd.
- Young Zo Yoo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Lead free solder alloy
- Patent number 8,221,560
- Issue date Jul 17, 2012
- Duksan Hi-Metal Co., Ltd.
- Kang Hee Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250001529
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING PILLAR
- Publication number 20240096832
- Publication date Mar 21, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR FOR CONDUCTIVE CONNECTION
- Publication number 20240088079
- Publication date Mar 14, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING METAL NANOWIRE AND LIGHT-TRANSMITTING ELECT...
- Publication number 20180323399
- Publication date Nov 8, 2018
- DUKSAN HI-METAL CO., LTD.
- Young Zo YOO
- B82 - NANO-TECHNOLOGY
Information Patent Application
METAL NANOWIRE AND LIGHT-TRANSMITTING ELECTRODE AND ORGANIC LIGHT-E...
- Publication number 20180315947
- Publication date Nov 1, 2018
- DUKSAN HI-METAL CO., LTD.
- Young Zo YOO
- B82 - NANO-TECHNOLOGY
Information Patent Application
CORE-SHELL NANOWIRE, METHOD FOR SYNTHESIZING THE CORE-SHELL NANOWIR...
- Publication number 20180026224
- Publication date Jan 25, 2018
- DUKSAN HI-METAL CO., LTD.
- Young Zo YOO
- B82 - NANO-TECHNOLOGY
Information Patent Application
METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDU...
- Publication number 20140183733
- Publication date Jul 3, 2014
- DUKSAN HI-METAL CO., LTD.
- Yong Cheol CHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTR...
- Publication number 20120067629
- Publication date Mar 22, 2012
- DUKSAN HI-METAL CO., LTD.
- Yong Un Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FREE SOLDER ALLOY AND MANUFACTURING METHOD THEREOF
- Publication number 20100272598
- Publication date Oct 28, 2010
- DUKSAN HI-METAL CO., LTD.
- Kang Hee Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

DUKSAN HI-METAL CO., LTD.

Organization

Patents Grantslast 30 patents

Metal core solder ball and heat dissipation structure for semicondu...

Method of manufacturing metal nanowire and light-transmitting elect...

Metal nanowire and light-transmitting electrode and organic light-e...

Core-shell nanowire, method for synthesizing the core-shell nanowir...

Lead free solder alloy

Patents Applicationslast 30 patents

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

CONNECTING PILLAR

METAL PILLAR FOR CONDUCTIVE CONNECTION

METHOD OF MANUFACTURING METAL NANOWIRE AND LIGHT-TRANSMITTING ELECT...

METAL NANOWIRE AND LIGHT-TRANSMITTING ELECTRODE AND ORGANIC LIGHT-E...

CORE-SHELL NANOWIRE, METHOD FOR SYNTHESIZING THE CORE-SHELL NANOWIR...

METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDU...

SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTR...

LEAD FREE SOLDER ALLOY AND MANUFACTURING METHOD THEREOF

Trademarklast 30 trademarks