Dyconex Patente AG

Organization

Zug, CH

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing micro-openings
- Patent number 6,601,297
- Issue date Aug 5, 2003
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing connecting conductors
- Patent number 6,486,394
- Issue date Nov 26, 2002
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection substrate
- Patent number 6,321,443
- Issue date Nov 27, 2001
- Dyconex Patente AG
- Hans-Jürg Barte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil circuit boards and semifinished products and method for the ma...
- Patent number 6,218,628
- Issue date Apr 17, 2001
- Dyconex Patente AG
- Walter Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating foil circuit board with rigid and flexible sections
- Patent number 6,162,996
- Issue date Dec 19, 2000
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for structuring polymer films
- Patent number 5,746,929
- Issue date May 5, 1998
- Dyconex Patente AG
- Walter Schmidt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing multilayer foil printed circuit boards
- Patent number 5,729,897
- Issue date Mar 24, 1998
- Dyconex Patente A.G.
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin laminated microstructure with precisely aligned openings
- Patent number 5,698,299
- Issue date Dec 16, 1997
- Dyconex Patente AG
- Walter Schmidt
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Structuring of printed circuit boards
- Patent number 5,651,899
- Issue date Jul 29, 1997
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the production of structures
- Patent number 5,639,389
- Issue date Jun 17, 1997
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the through plating of conductor foils
- Patent number 5,457,881
- Issue date Oct 17, 1995
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core for electrical connecting substrates and electrical connecting...
- Patent number 5,442,143
- Issue date Aug 15, 1995
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the production of printed circuit boards with extremely...
- Patent number 5,436,062
- Issue date Jul 25, 1995
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing substrates with passages
- Patent number 5,378,314
- Issue date Jan 3, 1995
- Dyconex Patente AG
- Walter Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dyconex Patente AG

Organization

Patents Grantslast 30 patents

Method for producing micro-openings

Process for producing connecting conductors

Connection substrate

Foil circuit boards and semifinished products and method for the ma...

Insulating foil circuit board with rigid and flexible sections

Process for structuring polymer films

Method of manufacturing multilayer foil printed circuit boards

Thin laminated microstructure with precisely aligned openings

Structuring of printed circuit boards

Process for the production of structures

Method for the through plating of conductor foils

Core for electrical connecting substrates and electrical connecting...

Process for the production of printed circuit boards with extremely...

Method for producing substrates with passages