E-PACK, INC

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ANN ARBOR, MI, US

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Patents Grantslast 30 patents

Information Patent Grant
Environment-resistant module, micropackage and methods of manufactu...
- Patent number 10,266,392
- Issue date Apr 23, 2019
- E-PACK, INC.
- Khalil Najafi
- B81 - MICRO-STRUCTURAL TECHNOLOGY