ESEC AG

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Cham, CH

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for mounting semiconductor chips
- Patent number 9,603,294
- Issue date Mar 21, 2017
- Esec AG
- Guido Suter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for mounting semiconductor chips
- Patent number 9,082,816
- Issue date Jul 14, 2015
- Esec AG
- Marco Graf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for detaching and removing a semiconductor chip from a foil
- Patent number 8,715,457
- Issue date May 6, 2014
- Esec AG
- Stefan Behler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for dispensing solder on a substrate and method for mounting...
- Patent number 8,573,467
- Issue date Nov 5, 2013
- Esec AG
- Heinrich Berchtold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die ejector
- Patent number 8,250,742
- Issue date Aug 28, 2012
- Esec AG
- Daniel Kloeckner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for mounting a flip chip on a substrate
- Patent number 8,166,637
- Issue date May 1, 2012
- Esec AG
- Patrick Blessing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ultrasonic transducer
- Patent number 8,106,564
- Issue date Jan 31, 2012
- Esec AG
- Silvan Thuerlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor mounting apparatus with a chip gripper travelling bac...
- Patent number 6,185,815
- Issue date Feb 13, 2001
- Esec SA
- Samuel Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for aligning the bonding head of a bonder, in...
- Patent number 6,179,938
- Issue date Jan 30, 2001
- Esec SA
- Eugen Mannhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic transducer with a flange for mounting on an ultrasonic w...
- Patent number 6,135,339
- Issue date Oct 24, 2000
- ESEC SA
- Lorenzo Parrini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making wire connections of predetermined shape
- Patent number 6,131,799
- Issue date Oct 17, 2000
- ESEC SA
- Hans Egger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor mounting apparatus for applying adhesive to a substrate
- Patent number 6,129,040
- Issue date Oct 10, 2000
- ESEC SA
- Franco Viggiano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing wire connections on semiconductor chips
- Patent number 6,119,926
- Issue date Sep 19, 2000
- ESEC SA
- Hans Egger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for shaping liquid portions of solder in soft soldering s...
- Patent number 6,056,184
- Issue date May 2, 2000
- ESEC SA
- Christoph B. Luchinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a wire connections of predetermined shape
- Patent number 6,010,057
- Issue date Jan 4, 2000
- ESEC SA
- Hans Egger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for making wire connections on semiconductor chips
- Patent number 5,893,509
- Issue date Apr 13, 1999
- ESEC SA
- Laurent Pasquier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for dispensing liquid solder
- Patent number 5,878,939
- Issue date Mar 9, 1999
- ESEC SA
- Christoph Luchinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor device and position determination process and their use for...
- Patent number 5,598,270
- Issue date Jan 28, 1997
- ESEC SA
- Claudio Meisser
- G01 - MEASURING TESTING
Information Patent Grant
Curing oven for magazine holding computer chip lead frames, providi...
- Patent number 5,569,402
- Issue date Oct 29, 1996
- ESEC SA
- Claudio Meisser
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method and apparatus for measuring the vibration amplitude on an en...
- Patent number 5,199,630
- Issue date Apr 6, 1993
- ESEC SA
- Armin Felber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for loading metal leadframes with electronic c...
- Patent number 5,163,222
- Issue date Nov 17, 1992
- Esec, SA
- Martin Imlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for performing in-feed of working member to working station
- Patent number 5,114,302
- Issue date May 19, 1992
- ESEC SA
- Claudio Meisser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for forming electric circuits on a lead frame
- Patent number 5,108,023
- Issue date Apr 28, 1992
- ESEC SA
- Emanuele Japichino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for ultrasonic contacting wire connection of circuits to...
- Patent number 4,903,883
- Issue date Feb 27, 1990
- ESEC SA
- Silvan Thurlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus For Mounting Semiconductor Chips
- Publication number 20130133188
- Publication date May 30, 2013
- ESEC AG
- Guido Suter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Apparatus For Mounting Semiconductor Chips
- Publication number 20130008599
- Publication date Jan 10, 2013
- ESEC AG
- Marco Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Dispensing Solder On A Substrate And Method For Mounting...
- Publication number 20120298730
- Publication date Nov 29, 2012
- ESEC AG
- Heinrich Berchtold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching And Removing A Semiconductor Chip From A Foil
- Publication number 20110214819
- Publication date Sep 8, 2011
- ESEC AG
- Stefan Behler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Device For Measuring A Height Difference
- Publication number 20100315655
- Publication date Dec 16, 2010
- ESEC AG
- Stefan Behler
- G01 - MEASURING TESTING
Information Patent Application
Method Of Forming A Paste Pattern
- Publication number 20100233369
- Publication date Sep 16, 2010
- ESEC AG
- Dietmar Krause
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Ejector
- Publication number 20100107405
- Publication date May 6, 2010
- ESEC AG
- Daniel Kloeckner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Mounting A Flip Chip On A Substrate
- Publication number 20100040449
- Publication date Feb 18, 2010
- ESEC AG
- Patrick Blessing
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
75804875 - EQDC
- Serial number 75804875
- Registration number 2408372
- Filing date Sep 21, 1999
- ESEC SA
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75538526 - B-BEM
- Serial number 75538526
- Registration number 2337572
- Filing date Aug 18, 1998
- ESEC SA
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74206473 - ESEC
- Serial number 74206473
- Registration number 1727050
- Filing date Sep 24, 1991
- ESEC SA
- 7 - Machines and machine tools
Information Trademark
74105122 - ESEC AUTOLINE
- Serial number 74105122
- Registration number 1736059
- Filing date Oct 11, 1990
- ESEC, SA
- 7 - Machines and machine tools

Organization

Patents Grantslast 30 patents

Apparatus for mounting semiconductor chips

Method and apparatus for mounting semiconductor chips

Method for detaching and removing a semiconductor chip from a foil

Method for dispensing solder on a substrate and method for mounting...

Die ejector

Apparatus for mounting a flip chip on a substrate

Ultrasonic transducer

Semiconductor mounting apparatus with a chip gripper travelling bac...

Method and apparatus for aligning the bonding head of a bonder, in...

Ultrasonic transducer with a flange for mounting on an ultrasonic w...

Method of making wire connections of predetermined shape

Semi-conductor mounting apparatus for applying adhesive to a substrate

Method for producing wire connections on semiconductor chips

Apparatus for shaping liquid portions of solder in soft soldering s...

Method for making a wire connections of predetermined shape

Apparatus for making wire connections on semiconductor chips

Method and apparatus for dispensing liquid solder

Sensor device and position determination process and their use for...

Curing oven for magazine holding computer chip lead frames, providi...

Method and apparatus for measuring the vibration amplitude on an en...

Method and apparatus for loading metal leadframes with electronic c...

Apparatus for performing in-feed of working member to working station

Device for forming electric circuits on a lead frame

Apparatus for ultrasonic contacting wire connection of circuits to...

Patents Applicationslast 30 patents

Apparatus For Mounting Semiconductor Chips

Method And Apparatus For Mounting Semiconductor Chips

Method For Dispensing Solder On A Substrate And Method For Mounting...

Method For Detaching And Removing A Semiconductor Chip From A Foil

Method And Device For Measuring A Height Difference

Method Of Forming A Paste Pattern

Die-Ejector

Apparatus For Mounting A Flip Chip On A Substrate

Trademarklast 30 trademarks

75804875 - EQDC

75538526 - B-BEM

74206473 - ESEC

74105122 - ESEC AUTOLINE