EV GROUP INC.

Organization

Tempe, AZ, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Die tool, device and method for producing a lens wafer
- Patent number 10,668,678
- Issue date Jun 2, 2020
- EV Group GmbH
- Michael Kast
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for producing a microlens
- Patent number 10,279,551
- Issue date May 7, 2019
- EV Group GmbH
- Erich Thallner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chuck adapted for automated coupling
- Patent number 9,925,597
- Issue date Mar 27, 2018
- EV Group GmbH
- Wolfgang Tiefenböck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for processing of wafers
- Patent number 9,771,223
- Issue date Sep 26, 2017
- EV Group GmbH
- Friedrich Paul Lindner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Device and method for processing wafers
- Patent number 9,751,698
- Issue date Sep 5, 2017
- EV Group GmbH
- Friedrich Paul Lindner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Die tool, device and method for producing a lens wafer
- Patent number 9,738,042
- Issue date Aug 22, 2017
- EV Group GmbH
- Michael Kast
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and device for producing a lens wafer
- Patent number 9,662,846
- Issue date May 30, 2017
- EV Group GmbH
- Michael Kast
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and device for producing a lens wafer
- Patent number 9,643,366
- Issue date May 9, 2017
- EV Group GmbH
- Michael Kast
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chuck adapted for automated coupling
- Patent number 9,555,479
- Issue date Jan 31, 2017
- EV Group GmbH
- Wolfgang Tiefenböck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for detaching a product substrate off a carrier substrate
- Patent number 9,457,552
- Issue date Oct 4, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for aligning and pre-fixing a wafer
- Patent number 9,449,863
- Issue date Sep 20, 2016
- EV Group GmbH
- Jurgen Burggraf
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device for detaching a product substrate off a carrier substrate
- Patent number 9,381,729
- Issue date Jul 5, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for stripping a product substrate from a carrier substrate
- Patent number 9,381,732
- Issue date Jul 5, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Receiving device for receiving semiconductor substrates
- Patent number 9,278,433
- Issue date Mar 8, 2016
- EV Group GmbH
- Herbert Tiefenböck
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Device for detaching a product substrate off a carrier substrate
- Patent number 9,272,501
- Issue date Mar 1, 2016
- EV Group GmbH
- Jurgen Burggraf
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for stripping a product substrate from a carrier substrate
- Patent number 9,186,877
- Issue date Nov 17, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for separating a substrate from a carrier substrate
- Patent number 9,138,978
- Issue date Sep 22, 2015
- EV Group GmbH
- Markus Wimplinger
- B32 - LAYERED PRODUCTS
Information Patent Grant
System having two oscillation components for machining a workpiece
- Patent number 9,061,388
- Issue date Jun 23, 2015
- EV Group GmbH
- Herbert Tiefenböck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for producing a microlens
- Patent number 9,052,422
- Issue date Jun 9, 2015
- EV Group GmbH
- Erich Thallner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device and method for stripping a product substrate from a carrier...
- Patent number 8,986,496
- Issue date Mar 24, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for aligning and pre-fixing a wafer
- Patent number 8,918,989
- Issue date Dec 30, 2014
- EV Group GmbH
- Jürgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for releasing an interconnect layer that provides connection...
- Patent number 8,905,111
- Issue date Dec 9, 2014
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device and method for detaching a semiconductor wafer from a substrate
- Patent number 8,894,807
- Issue date Nov 25, 2014
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device and method for loosening a polymer layer from a surface of a...
- Patent number 8,828,147
- Issue date Sep 9, 2014
- EV Group GmbH
- Matt Crowder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handling device for handling of a wafer
- Patent number 8,714,611
- Issue date May 6, 2014
- EV Group GmbH
- Ingo Brandstätter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stripping a wafer from a carrier
- Patent number 8,603,294
- Issue date Dec 10, 2013
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding of chips on wafers
- Patent number 8,597,980
- Issue date Dec 3, 2013
- EV Group GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for separating a substrate from a carrier substrate
- Patent number 8,449,716
- Issue date May 28, 2013
- EV Group GmbH
- Markus Wimplinger
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for stripping a wafer from a carrier
- Patent number 8,443,864
- Issue date May 21, 2013
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for improving the detachment of paper from the...
- Patent number 8,438,754
- Issue date May 14, 2013
- EV Group Oy
- Ilpo Pitkäniemi
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A MICROLENS
- Publication number 20180229458
- Publication date Aug 16, 2018
- EV Group GmbH
- Erich Thallner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DIE TOOL, DEVICE AND METHOD FOR PRODUCING A LENS WAFER
- Publication number 20170305086
- Publication date Oct 26, 2017
- EV Group GmbH
- Michael Kast
- G02 - OPTICS
Information Patent Application
CHUCK ADAPTED FOR AUTOMATED COUPLING
- Publication number 20170100780
- Publication date Apr 13, 2017
- EV Group GmbH
- Wolfgang Tiefenbock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR PRODUCING A LENS WAFER
- Publication number 20150290888
- Publication date Oct 15, 2015
- EV Group GmbH
- Michael Kast
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ACCOMMODATING DEVICE FOR ACCOMMODATION AND MOUNTING OF A WAFER
- Publication number 20150270155
- Publication date Sep 24, 2015
- EV GROUP INC.
- Spencer Hochstetler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE
- Publication number 20150251404
- Publication date Sep 10, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND DEVICE FOR PRODUCING A MICROLENS
- Publication number 20150231840
- Publication date Aug 20, 2015
- EV Group GmbH
- Erich Thallner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE
- Publication number 20150096690
- Publication date Apr 9, 2015
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR ALIGNING AND PRE-FIXING A WAFER
- Publication number 20150089783
- Publication date Apr 2, 2015
- EV Group GmbH
- Jurgen BURGGRAF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE
- Publication number 20150075725
- Publication date Mar 19, 2015
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...
- Publication number 20130340947
- Publication date Dec 26, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...
- Publication number 20130327485
- Publication date Dec 12, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR PROCESSING OF WAFERS
- Publication number 20130309046
- Publication date Nov 21, 2013
- EV Group GmbH
- Friedrich Paul Lindner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...
- Publication number 20130276990
- Publication date Oct 24, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM HAVING TWO OSCILLATION COMPONENTS FOR MACHINING A WORKPLACE
- Publication number 20130259592
- Publication date Oct 3, 2013
- EV Group GMBH
- Herbert Tiefenböck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR PROCESSING WAFERS
- Publication number 20130240113
- Publication date Sep 19, 2013
- EV Group GmbH
- Friedrich Paul Lindner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD AND DEVICE FOR PRODUCING A LENS WAFER
- Publication number 20130193596
- Publication date Aug 1, 2013
- EV Group GmbH
- Michael Kast
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DEVICE FOR SEPARATING A SUBSTRATE FROM A CARRIER SUBSTRATE
- Publication number 20130168027
- Publication date Jul 4, 2013
- EV GROUP GMBH
- Markus Wimplinger
- B32 - LAYERED PRODUCTS
Information Patent Application
CHUCK WHICH CAN BE COUPLED BY AUTOMATION
- Publication number 20130154206
- Publication date Jun 20, 2013
- EV Group GmbH
- Wolfgang Tiefenböck
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20130139972
- Publication date Jun 6, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20120000613
- Publication date Jan 5, 2012
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR LOOSENING A POLYMER LAYER FROM A SURFACE OF A...
- Publication number 20110265822
- Publication date Nov 3, 2011
- EV Group GmbH
- Matt Crowder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR IMPROVING THE DETACHMENT OF PAPER FROM A D...
- Publication number 20110154685
- Publication date Jun 30, 2011
- EV GROUP OY
- Ilpo Pitkäniemi
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE

EV GROUP INC.

Organization

Patents Grantslast 30 patents

Die tool, device and method for producing a lens wafer

Method for producing a microlens

Chuck adapted for automated coupling

Device and method for processing of wafers

Device and method for processing wafers

Die tool, device and method for producing a lens wafer

Method and device for producing a lens wafer

Method and device for producing a lens wafer

Chuck adapted for automated coupling

Method for detaching a product substrate off a carrier substrate

Device for aligning and pre-fixing a wafer

Device for detaching a product substrate off a carrier substrate

Device for stripping a product substrate from a carrier substrate

Receiving device for receiving semiconductor substrates

Device for detaching a product substrate off a carrier substrate

Method for stripping a product substrate from a carrier substrate

Device for separating a substrate from a carrier substrate

System having two oscillation components for machining a workpiece

Method and device for producing a microlens

Device and method for stripping a product substrate from a carrier...

Device for aligning and pre-fixing a wafer

Device for releasing an interconnect layer that provides connection...

Device and method for detaching a semiconductor wafer from a substrate

Device and method for loosening a polymer layer from a surface of a...

Handling device for handling of a wafer

Method for stripping a wafer from a carrier

Method for bonding of chips on wafers

Device and method for separating a substrate from a carrier substrate

Device for stripping a wafer from a carrier

Apparatus and method for improving the detachment of paper from the...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A MICROLENS

DIE TOOL, DEVICE AND METHOD FOR PRODUCING A LENS WAFER

CHUCK ADAPTED FOR AUTOMATED COUPLING

METHOD AND DEVICE FOR PRODUCING A LENS WAFER

ACCOMMODATING DEVICE FOR ACCOMMODATION AND MOUNTING OF A WAFER

METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE

METHOD AND DEVICE FOR PRODUCING A MICROLENS

METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE

DEVICE FOR ALIGNING AND PRE-FIXING A WAFER

DEVICE FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE

DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...

DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...

DEVICE AND METHOD FOR PROCESSING OF WAFERS

DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...

SYSTEM HAVING TWO OSCILLATION COMPONENTS FOR MACHINING A WORKPLACE

DEVICE AND METHOD FOR PROCESSING WAFERS

METHOD AND DEVICE FOR PRODUCING A LENS WAFER

DEVICE FOR SEPARATING A SUBSTRATE FROM A CARRIER SUBSTRATE

CHUCK WHICH CAN BE COUPLED BY AUTOMATION

METHOD FOR STRIPPING A WAFER FROM A CARRIER

DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER

DEVICE AND METHOD FOR LOOSENING A POLYMER LAYER FROM A SURFACE OF A...

APPARATUS AND METHOD FOR IMPROVING THE DETACHMENT OF PAPER FROM A D...

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