Express Packaging Systems, Inc.

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Palo Alto, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Low-cost surface-mount compatible land-grid array (LGA) chip scale...
- Patent number 6,075,710
- Issue date Jun 13, 2000
- Express Packaging Systems, Inc.
- John H. Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader with a placement recess and bottom saw-teeth for conn...
- Patent number 6,057,601
- Issue date May 2, 2000
- Express Packaging Systems, Inc.
- John H. Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-core two-side substrate with u-strip and co-planar signal tr...
- Patent number 5,825,084
- Issue date Oct 20, 1998
- Express Packaging Systems, Inc.
- John H. Lau
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
75290681 - EPS WIN WITH EPS
- Serial number 75290681
- Filing date Apr 30, 1997
- Express Packaging Systems, Inc.
- 42 - Scientific and technological services and research and design relating thereto