Fasford Technology Co., Ltd.

Organization

Minami-Alps City, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 12,068,275
- Issue date Aug 20, 2024
- FASFORD TECHNOLOGY CO., LTD.
- Ryo Saegusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding apparatus, cleaning head and manufacturing method for s...
- Patent number 12,053,806
- Issue date Aug 6, 2024
- FASFORD TECHNOLOGY CO., LTD.
- Itsuki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 11,692,947
- Issue date Jul 4, 2023
- FASFORD TECHNOLOGY CO., LTD.
- Yuta Ono
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor manufacturing apparatus and manufacturing method for...
- Patent number 11,569,118
- Issue date Jan 31, 2023
- FASFORD TECHNOLOGY CO., LTD.
- Tsuyoshi Yokomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and bonding method
- Patent number 10,096,526
- Issue date Oct 9, 2018
- FASFORD TECHNOLOGY CO., LTD.
- Masayuki Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and bonding method
- Patent number 9,530,751
- Issue date Dec 27, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Kazuo Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonder and bonding method
- Patent number 9,362,250
- Issue date Jun 7, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Ryuichi Takano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pick-up method of die bonder and die bonder
- Patent number 9,343,338
- Issue date May 17, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Naoki Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Two-shaft drive mechanism and die bonder
- Patent number 9,324,679
- Issue date Apr 26, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Yoshihide Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collet cleaning method and die bonder using the same
- Patent number 9,318,361
- Issue date Apr 19, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Yoshihide Ishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die bonding apparatus, die picking up apparatus and die picking up...
- Patent number 9,245,778
- Issue date Jan 26, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Keita Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reaction absorber and semiconductor assembling system
- Patent number 9,177,937
- Issue date Nov 3, 2015
- FASFORD TECHNOLOGY CO., LTD.
- Masayuki Mochizuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die bonder
- Patent number 9,099,524
- Issue date Aug 4, 2015
- FASFORD TECHNOLOGY CO., LTD.
- Yoshiaki Makita
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Manufacturing Device, Push-up Unit, and Method of Man...
- Publication number 20240312825
- Publication date Sep 19, 2024
- Fasford Technology Co., Ltd.
- Akira Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, CARRIER JIG, AND MANUFACTURI...
- Publication number 20230290666
- Publication date Sep 14, 2023
- Fasford Technology Co., Ltd.
- Keita YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, INSPECTION APPARATUS, AND MA...
- Publication number 20230215770
- Publication date Jul 6, 2023
- Fasford Technology Co., Ltd.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Apparatus and Manufacturing Method for...
- Publication number 20230120615
- Publication date Apr 20, 2023
- Fasford Technology Co., Ltd.
- Tsuyoshi YOKOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
- Publication number 20220238357
- Publication date Jul 28, 2022
- Fasford Technology Co., Ltd.
- Akira SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor Ap...
- Publication number 20220199433
- Publication date Jun 23, 2022
- Fasford Technology Co., Ltd.
- Hideharu Kobashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die Bonding Apparatus, Cleaning Head and Manufacturing Method for S...
- Publication number 20220055077
- Publication date Feb 24, 2022
- Fasford Technology Co., Ltd.
- Itsuki IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
- Publication number 20220052017
- Publication date Feb 17, 2022
- Fasford Technology Co., Ltd.
- Ryo SAEGUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
- Publication number 20220034823
- Publication date Feb 3, 2022
- Fasford Technology Co., Ltd.
- Yuta ONO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Manufacturing Apparatus and Manufacturing Method for...
- Publication number 20200312699
- Publication date Oct 1, 2020
- Fasford Technology Co., Ltd.
- Tsuyoshi YOKOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20160099225
- Publication date Apr 7, 2016
- Fasford Technology Co., Ltd.
- Kazuo NAKANO
- H01 - BASIC ELECTRIC ELEMENTS

Fasford Technology Co., Ltd.

Organization

Patents Grantslast 30 patents

Die bonding apparatus and manufacturing method for semiconductor de...

Die bonding apparatus, cleaning head and manufacturing method for s...

Die bonding apparatus and manufacturing method for semiconductor de...

Semiconductor manufacturing apparatus and manufacturing method for...

Die bonder and bonding method

Die bonder and bonding method

Die bonder and bonding method

Pick-up method of die bonder and die bonder

Two-shaft drive mechanism and die bonder

Collet cleaning method and die bonder using the same

Die bonding apparatus, die picking up apparatus and die picking up...

Reaction absorber and semiconductor assembling system

Die bonder

Patents Applicationslast 30 patents

Semiconductor Manufacturing Device, Push-up Unit, and Method of Man...

SEMICONDUCTOR MANUFACTURING APPARATUS, CARRIER JIG, AND MANUFACTURI...

SEMICONDUCTOR MANUFACTURING APPARATUS, INSPECTION APPARATUS, AND MA...

Semiconductor Manufacturing Apparatus and Manufacturing Method for...

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

Die Bonding Apparatus and Manufacturing Method for Semiconductor De...

Die Bonding Apparatus and Manufacturing Method for Semiconductor Ap...

Die Bonding Apparatus, Cleaning Head and Manufacturing Method for S...

Die Bonding Apparatus and Manufacturing Method for Semiconductor De...

Die Bonding Apparatus and Manufacturing Method for Semiconductor De...

Semiconductor Manufacturing Apparatus and Manufacturing Method for...

Die Bonder and Bonding Method