First Hi-tec Enterprise Co., Ltd.

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Taoyuan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noise suppression structure for differential pair
- Patent number 11,877,385
- Issue date Jan 16, 2024
- First Hi-tec Enterprise Co., Ltd.
- Ching-Shan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate
- Patent number 10,559,534
- Issue date Feb 11, 2020
- Industrial Technology Research Institute
- Sheng-Che Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit structure
- Patent number 10,129,974
- Issue date Nov 13, 2018
- Industrial Technology Research Institute
- Chien-Min Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR
- Publication number 20240023227
- Publication date Jan 18, 2024
- FIRST HI-TEC ENTERPRISE Co., Ltd.
- Ching-Shan CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC PACKAGE USING THE SAME
- Publication number 20230189435
- Publication date Jun 15, 2023
- First Hi-tec Enterprise Co.,Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20190148300
- Publication date May 16, 2019
- Industrial Technology Research Institute
- Sheng-Che Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CIRCUIT STRUCTURE
- Publication number 20170273174
- Publication date Sep 21, 2017
- Industrial Technology Research Institute
- Chien-Min Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks