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Kagoshima, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Heat sink, cooling module and coolable electronic board
Patent number
8,982,559
Issue date
Mar 17, 2015
Fuchigami Micro Co., Ltd.
Kenji Ohsawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat pipe and circuit board with a heat pipe function
Patent number
8,611,089
Issue date
Dec 17, 2013
Fuchigami Micro Co., Ltd.
Kei Mizuta
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Method for etching laminated assembly including polyimide layer
Patent number
6,783,921
Issue date
Aug 31, 2004
Sumitomo Electric Industries, Ltd.
Shingo Kaimori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayered circuit board for semiconductor chip module, and metho...
Patent number
6,555,763
Issue date
Apr 29, 2003
Fuchigami Micro Co., Ltd.
Koki Hirasawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
HEAT PIPE AND METHOD FOR MANUFACTURING SAME
Publication number
20210310745
Publication date
Oct 7, 2021
Fuchigami Micro Co., Ltd
Kenji Ohsawa
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Boar...
Publication number
20120106084
Publication date
May 3, 2012
Kagoshima University
Kei Mizuta
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
Heat Sink, Cooling Module And Coolable Electronic Board
Publication number
20110214904
Publication date
Sep 8, 2011
Fuchigami Micro Co., Ltd
Kenji Ohsawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Heat Pipe and Method for Manufacturing Same
Publication number
20080135214
Publication date
Jun 12, 2008
FUCHIGAMI MICRO CO., LTD.
Kenji Ohsawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Trademark
last 30 trademarks