FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.

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Shenzhen City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 9,706,640
- Issue date Jul 11, 2017
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and method for making the same
- Patent number 9,693,448
- Issue date Jun 27, 2017
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and method for manufacturing same
- Patent number 9,622,340
- Issue date Apr 11, 2017
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and method for manufacturing same
- Patent number 9,615,445
- Issue date Apr 4, 2017
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and method for manufacturing same
- Patent number 9,485,859
- Issue date Nov 1, 2016
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method for making same
- Patent number 9,357,631
- Issue date May 31, 2016
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board with circuit visible
- Patent number 9,288,914
- Issue date Mar 15, 2016
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method for manufacturing same
- Patent number 9,277,640
- Issue date Mar 1, 2016
- FuKui Precison Component (Shenzhen) Co., Ltd.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact rigid-flexible printed circuit board and method for manufac...
- Patent number 9,210,811
- Issue date Dec 8, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Biao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing rigid-flexible printed circuit board
- Patent number 9,198,304
- Issue date Nov 24, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Biao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 9,125,334
- Issue date Sep 1, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Hui Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 9,107,311
- Issue date Aug 11, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 9,095,082
- Issue date Jul 28, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Hui Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flex printed circuit board and method for making same
- Patent number 9,072,173
- Issue date Jun 30, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ning Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 9,066,417
- Issue date Jun 23, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board with patterned elect...
- Patent number 9,066,431
- Issue date Jun 23, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 8,978,244
- Issue date Mar 17, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Xue-Jun Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board having mo...
- Patent number 8,850,701
- Issue date Oct 7, 2014
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Xue-Jun Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,648,261
- Issue date Feb 11, 2014
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Feng-Yan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing rigid-flexible printed circuit board
- Patent number 8,591,692
- Issue date Nov 26, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ming-De Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board with cavity
- Patent number 8,516,694
- Issue date Aug 27, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Xue-Jun Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device and connector assembly having same
- Patent number 8,481,854
- Issue date Jul 9, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Hui Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming electrical traces on substrate
- Patent number 8,475,867
- Issue date Jul 2, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Yao-Wen Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing multilayer flexible printed circuit board
- Patent number 8,453,321
- Issue date Jun 4, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Jun-Qing Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing FPCB substrate
- Patent number 8,453,324
- Issue date Jun 4, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for screen printing printed circuit board substrate
- Patent number 8,448,571
- Issue date May 28, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Xiao-Fei Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for wet processing substrate
- Patent number 8,388,800
- Issue date Mar 5, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Yao-Wen Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Coverlay processing system
- Patent number 8,322,017
- Issue date Dec 4, 2012
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Kai Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board with plat...
- Patent number 8,302,300
- Issue date Nov 6, 2012
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ye-Ning Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board holder
- Patent number 8,223,505
- Issue date Jul 17, 2012
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Cheng-Bin Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20180310412
- Publication date Oct 25, 2018
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- LEI ZHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180192516
- Publication date Jul 5, 2018
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE, METHOD FOR MAKING THE SAME, AND ELECTRO...
- Publication number 20180082924
- Publication date Mar 22, 2018
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- FU-YUN SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE AND METHOD FOR SAME
- Publication number 20170354030
- Publication date Dec 7, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING CONDUCTIVE POLYMER, AND COMPOSITE FILM AND CIRCUI...
- Publication number 20170339782
- Publication date Nov 23, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- MING-JAAN HO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20170339795
- Publication date Nov 23, 2017
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- YAN-LU LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRATHIN HEAT DISSIPATION STRUCTURE AND A METHOD FOR MANUFACTURING...
- Publication number 20170325356
- Publication date Nov 9, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- NING HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND ADHESIVE FILM AND CIRCUIT BOARD MADE OF THE SAME
- Publication number 20170275508
- Publication date Sep 28, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- MAO-FENG HSU
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20170265295
- Publication date Sep 14, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20170188451
- Publication date Jun 29, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20170127519
- Publication date May 4, 2017
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YU-CHENG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR RADIO TRANSCEIVING AND METHOD FOR MANUFACTURING SAME
- Publication number 20170110244
- Publication date Apr 20, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- XIAN-QIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170110427
- Publication date Apr 20, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- WEI-SHUO SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20170105280
- Publication date Apr 13, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, CHIP PACKAGE WITH SAME AND METHOD FOR MANUFACTURING SAME
- Publication number 20170084509
- Publication date Mar 23, 2017
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YU-CHENG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20170079136
- Publication date Mar 16, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- SZU-HSIANG SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20170027054
- Publication date Jan 26, 2017
- ZHEN DING TECHNOLOGY CO., LTD.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20160381786
- Publication date Dec 29, 2016
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING...
- Publication number 20160381833
- Publication date Dec 29, 2016
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YU-CHENG HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MAKING THE SAME, AND PORTABLE ELECTRONIC...
- Publication number 20160366766
- Publication date Dec 15, 2016
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- TZU-CHIEN YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20160353582
- Publication date Dec 1, 2016
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- WEI-SHUO SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160351753
- Publication date Dec 1, 2016
- HongQiSheng Precision Electronics (QinHuangDao) Co
- YU-CHENG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN HEAT DISSIPATION FOIL AND METHOD FOR MANUFACTURING SAME
- Publication number 20160320142
- Publication date Nov 3, 2016
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- MING-JAAN HO
- B32 - LAYERED PRODUCTS
Information Patent Application
HYBRID CIRCUIT BOARD AND METHOD FOR MAKING THE SAME, AND SEMICONDUC...
- Publication number 20160240464
- Publication date Aug 18, 2016
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- YU-CHENG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20160183357
- Publication date Jun 23, 2016
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- Ming-Jaan HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160181181
- Publication date Jun 23, 2016
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- WEI-SHUO SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20160150635
- Publication date May 26, 2016
- HongQiSheng Precision Electronics (QinHuanDao) Co., Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PART-EMBEDDED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160066418
- Publication date Mar 3, 2016
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YU-HAO CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160061540
- Publication date Mar 3, 2016
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- XIAN-QIN HU
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20150189760
- Publication date Jul 2, 2015
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.

Organization

Patents Grantslast 30 patents

Method for manufacturing printed circuit board

Flexible circuit board and method for making the same

Flexible circuit board and method for manufacturing same

Flexible circuit board and method for manufacturing same

Flexible circuit board and method for manufacturing same

Flexible printed circuit board and method for making same

Method of manufacturing a printed circuit board with circuit visible

Flexible printed circuit board and method for manufacturing same

Compact rigid-flexible printed circuit board and method for manufac...

Method for manufacturing rigid-flexible printed circuit board

Method for manufacturing multilayer printed circuit board

Method for manufacturing printed circuit board

Method for manufacturing multilayer printed circuit board

Rigid-flex printed circuit board and method for making same

Method for manufacturing printed circuit board

Method for manufacturing printed circuit board with patterned elect...

Method for manufacturing printed circuit board

Method for manufacturing multilayer printed circuit board having mo...

Printed circuit board

Method for manufacturing rigid-flexible printed circuit board

Method for manufacturing printed circuit board with cavity

Electronic component device and connector assembly having same

Method for forming electrical traces on substrate

Method for manufacturing multilayer flexible printed circuit board

Method of manufacturing FPCB substrate

Method for screen printing printed circuit board substrate

Apparatus for wet processing substrate

Coverlay processing system

Method for manufacturing multilayer printed circuit board with plat...

Flexible printed circuit board holder

Patents Applicationslast 30 patents

METHOD OF MAKING A FLEXIBLE PRINTED CIRCUIT BOARD

COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

HEAT DISSIPATION STRUCTURE, METHOD FOR MAKING THE SAME, AND ELECTRO...

HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE AND METHOD FOR SAME

METHOD FOR MAKING CONDUCTIVE POLYMER, AND COMPOSITE FILM AND CIRCUI...

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

ULTRATHIN HEAT DISSIPATION STRUCTURE AND A METHOD FOR MANUFACTURING...

RESIN COMPOSITION AND ADHESIVE FILM AND CIRCUIT BOARD MADE OF THE SAME

PRINTED CIRCUIT BOARD

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD FOR RADIO TRANSCEIVING AND METHOD FOR MANUFACTURING SAME

CHIP PACKAGE AND METHOD FOR MANUFACTURING SAME

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

SUBSTRATE, CHIP PACKAGE WITH SAME AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

HEAT SINK, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING...

CIRCUIT BOARD, METHOD FOR MAKING THE SAME, AND PORTABLE ELECTRONIC...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

THIN HEAT DISSIPATION FOIL AND METHOD FOR MANUFACTURING SAME

HYBRID CIRCUIT BOARD AND METHOD FOR MAKING THE SAME, AND SEMICONDUC...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

PART-EMBEDDED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING SAME

HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING SAME

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME