General Wire & Stamping Company, Incorporated

Organization

  • Randolph, NJ, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Plating structure for a pin grid array package

    • Patent number 6,051,119
    • Issue date Apr 18, 2000
    • International Business Machines Corporation
    • Paul F. Findeis
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR