Global Wafers Japan Co., Ltd.

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Nigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thermal treatment method of silicon wafer and silicon wafer
- Patent number 9,059,099
- Issue date Jun 16, 2015
- Global Wafers Japan Co., Ltd.
- Takeshi Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer and method for heat-treating silicon wafer
- Patent number 8,999,864
- Issue date Apr 7, 2015
- Global Wafers Japan Co., Ltd.
- Takeshi Senda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing single crystal silicon wafer from ingot gro...
- Patent number 8,476,149
- Issue date Jul 2, 2013
- Global Wafers Japan Co., Ltd.
- Hiromichi Isogai
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SILICON WAFER AND SILICON WAFER
- Publication number 20240304458
- Publication date Sep 12, 2024
- GLOBAL WAFERS JAPAN CO., LTD.
- Susumu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks