HAESUNG DS CO., LTD

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Changwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Pre-mold substrate and method of manufacturing pre-mold substrate
- Patent number 12,249,571
- Issue date Mar 11, 2025
- HAESUNG DS CO., LTD.
- Kwang Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and sensor package module including the same
- Patent number 12,104,964
- Issue date Oct 1, 2024
- HAESUNG DS CO., LTD.
- Jin Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board manufacturing apparatus
- Patent number 12,041,731
- Issue date Jul 16, 2024
- HAESUNG DS CO., LTD
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
- Patent number 11,876,012
- Issue date Jan 16, 2024
- HAESUNG DS CO., LTD.
- Sung Il Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,854,830
- Issue date Dec 26, 2023
- HAESUNG DS CO., LTD.
- Dong Jin Yoon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Saw based optical sensor device and package including the same
- Patent number 11,674,890
- Issue date Jun 13, 2023
- HAESUNG DS CO., LTD.
- Jin Woo Lee
- G01 - MEASURING TESTING
Information Patent Grant
Sensor package with reduced height cavity walls and sensor package...
- Patent number 11,209,323
- Issue date Dec 28, 2021
- HAESUNG DS CO., LTD.
- Jin Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor package formed by roll-to-roll process
- Patent number 11,139,220
- Issue date Oct 5, 2021
- HAESUNG DS CO., LTD.
- Jea Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Saw based optical sensor device and package including the same
- Patent number 11,112,352
- Issue date Sep 7, 2021
- HAESUNG DS CO., LTD.
- Jin Woo Lee
- G01 - MEASURING TESTING
Information Patent Grant
Sensor unit, temperature sensor including the same, method of manuf...
- Patent number 10,942,070
- Issue date Mar 9, 2021
- HAESUNG DS CO., LTD.
- Jin Woo Lee
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
- Patent number 10,910,299
- Issue date Feb 2, 2021
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene synthesis apparatus and graphene synthesis method using th...
- Patent number 10,882,748
- Issue date Jan 5, 2021
- HAESUNG DS CO., LTD.
- Dong Kwan Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package substrate
- Patent number 10,840,161
- Issue date Nov 17, 2020
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and method for manufacturing same
- Patent number 10,840,170
- Issue date Nov 17, 2020
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
- Patent number 10,811,302
- Issue date Oct 20, 2020
- HAESUNG DS CO., LTD.
- Sung II Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor having substrate including light sensing area and...
- Patent number 10,749,066
- Issue date Aug 18, 2020
- HAESUNG DS CO., LTD.
- Jin Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensor patch and adhesive type thermometer including th...
- Patent number 10,739,205
- Issue date Aug 11, 2020
- HAESUNG DS CO., LTD.
- Jae Hoon Jang
- G01 - MEASURING TESTING
Information Patent Grant
Graphene wire, cable employing the same, and method of manufacturin...
- Patent number 10,714,231
- Issue date Jul 14, 2020
- HAESUNG DS CO., LTD.
- Dong Kwan Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leakage detection system and leakage detection method
- Patent number 10,641,679
- Issue date May 5, 2020
- HAESUNG DS CO., LTD.
- Hyun Tae Lim
- G08 - SIGNALLING
Information Patent Grant
Semiconductor package substrate and method for manufacturing same
- Patent number 10,643,932
- Issue date May 5, 2020
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and manufacturing method therefor
- Patent number 10,643,933
- Issue date May 5, 2020
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element for adhesive thermometer
- Patent number D842136
- Issue date Mar 5, 2019
- HAESUNG DS CO., LTD.
- Jae Hoon Jang
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Bleed-out preventing agent, composition for preventing bleed-out in...
- Patent number 10,196,367
- Issue date Feb 5, 2019
- HAESUNG DS CO., LTD.
- Soeng Ick Kim
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Adhesive thermometer
- Patent number D833305
- Issue date Nov 13, 2018
- HAESUNG DS CO., LTD.
- Jae Hoon Jang
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Element for adhesive thermometer
- Patent number D833306
- Issue date Nov 13, 2018
- HAESUNG DS CO., LTD.
- Jae Hoon Jang
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Reel-to-reel inspection apparatus and inspection method using the same
- Patent number 9,671,352
- Issue date Jun 6, 2017
- HAESUNG DS CO., LTD.
- Suck-Ha Woo
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing multi-layer circuit board and multi-layer c...
- Patent number 9,532,466
- Issue date Dec 27, 2016
- HAESUNG DS CO., LTD.
- Sang-min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package substrate with limite...
- Patent number 9,460,986
- Issue date Oct 4, 2016
- HAESUNG DS CO., LTD.
- Sung Il Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing lead frame
- Patent number 9,299,588
- Issue date Mar 29, 2016
- HAESUNG DS CO., LTD.
- Jeung-Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board and chip package and circuit...
- Patent number 9,257,310
- Issue date Feb 9, 2016
- HAESUNG DS CO., LTD.
- Sang-Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20250071909
- Publication date Feb 27, 2025
- HAESUNG DS CO., LTD.
- Soon-Chul KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE
- Publication number 20250022722
- Publication date Jan 16, 2025
- HAESUNG DS CO., LTD.
- Jongwoo PARK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING LEAD FRAME
- Publication number 20250006508
- Publication date Jan 2, 2025
- HAESUNG DS CO., LTD.
- Gwang Ryeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...
- Publication number 20240431035
- Publication date Dec 26, 2024
- HAESUNG DS CO., LTD.
- Myeong Jin HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME INCLUDING LEAD WITH GROOVE FORMED THEREIN
- Publication number 20240194571
- Publication date Jun 13, 2024
- HAESUNG DS CO., LTD
- Do Yeon WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE
- Publication number 20240170291
- Publication date May 23, 2024
- HAESUNG DS CO., LTD.
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLD SUBSTRATE AND METHOD OF MANUFACTURING PRE-MOLD SUBSTRATE
- Publication number 20240038652
- Publication date Feb 1, 2024
- HAESUNG DS CO., LTD
- Kwang Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING TH...
- Publication number 20230317574
- Publication date Oct 5, 2023
- HAESUNG DS CO., LTD.
- Suyoen SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS
- Publication number 20230114747
- Publication date Apr 13, 2023
- HAESUNG DS CO., LTD.
- Sang Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS CHARGE COIL
- Publication number 20230106085
- Publication date Apr 6, 2023
- HAESUNG DS CO., LTD.
- Sang Hak LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS CHARGE COIL
- Publication number 20230104216
- Publication date Apr 6, 2023
- HAESUNG DS CO., LTD.
- Sang Hak LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REEL-TO-REEL CIRCUIT BOARD MANUFACTURING APPARATUS
- Publication number 20230101713
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Hyun Tae LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME
- Publication number 20230102887
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REEL-TO-REEL COMPONENT DRYING APPARATUS
- Publication number 20230097759
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Seung Seob LEE
- F26 - DRYING
Information Patent Application
REEL-TO-REEL CIRCUIT BOARD MANUFACTURING APPARATUS
- Publication number 20230102076
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Chonghan PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS AND MULTILAYER CIR...
- Publication number 20230095254
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Sang Min LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REEL-TO-REEL SURFACE PRESS APPARATUS
- Publication number 20230094795
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Yong Nam Kim
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WORKING TABLE FOR REEL-TO-REEL PROCESS
- Publication number 20230083630
- Publication date Mar 16, 2023
- HAESUNG DS CO., LTD.
- Jongwoo Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230080101
- Publication date Mar 16, 2023
- HAESUNG DS CO., LTD.
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAM...
- Publication number 20220285251
- Publication date Sep 8, 2022
- HAESUNG DS CO., LTD.
- Wonbin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR GRINDING SURFACE OF SUBSTRATE
- Publication number 20220274223
- Publication date Sep 1, 2022
- HAESUNG DS CO., LTD.
- Jong Hoe Ku
- B24 - GRINDING POLISHING
Information Patent Application
SENSOR PACKAGE AND SENSOR PACKAGE MODULE INCLUDING THE SAME
- Publication number 20220082454
- Publication date Mar 17, 2022
- HAESUNG DS CO., LTD
- Jin Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COIL PATTERN FOR WIRELESS CHARGING AND MAGNETIC SECURE TR...
- Publication number 20220021415
- Publication date Jan 20, 2022
- HAESUNG DS CO., LTD
- Ki Min LEE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SAW BASED OPTICAL SENSOR DEVICE AND PACKAGE INCLUDING THE SAME
- Publication number 20210381952
- Publication date Dec 9, 2021
- HAESUNG DS CO., LTD
- Jin Woo LEE
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20210217629
- Publication date Jul 15, 2021
- HAESUNG DS CO., LTD
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF POLISHING SURFACE OF SUBSTRATE
- Publication number 20210107094
- Publication date Apr 15, 2021
- HAESUNG DS CO., LTD
- Sung Il KANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD...
- Publication number 20210098268
- Publication date Apr 1, 2021
- HAESUNG DS CO., LTD
- Dong Young PYEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210057301
- Publication date Feb 25, 2021
- HAESUNG DS CO., LTD
- Jea Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...
- Publication number 20200411362
- Publication date Dec 31, 2020
- HAESUNG DS CO., LTD
- Sung Il KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200227344
- Publication date Jul 16, 2020
- HAESUNG DS CO., LTD
- In Seob BAE
- H01 - BASIC ELECTRIC ELEMENTS

HAESUNG DS CO., LTD

Organization

Patents Grantslast 30 patents

Pre-mold substrate and method of manufacturing pre-mold substrate

Sensor package and sensor package module including the same

Multilayer circuit board manufacturing apparatus

Method of manufacturing semiconductor package substrate and semicon...

Method of manufacturing circuit board

Saw based optical sensor device and package including the same

Sensor package with reduced height cavity walls and sensor package...

Flexible semiconductor package formed by roll-to-roll process

Saw based optical sensor device and package including the same

Sensor unit, temperature sensor including the same, method of manuf...

Method of manufacturing semiconductor package substrate and semicon...

Graphene synthesis apparatus and graphene synthesis method using th...

Method for manufacturing semiconductor package substrate

Semiconductor package substrate and method for manufacturing same

Method of manufacturing semiconductor package substrate and semicon...

Proximity sensor having substrate including light sensing area and...

Temperature sensor patch and adhesive type thermometer including th...

Graphene wire, cable employing the same, and method of manufacturin...

Leakage detection system and leakage detection method

Semiconductor package substrate and method for manufacturing same

Semiconductor package substrate and manufacturing method therefor

Element for adhesive thermometer

Bleed-out preventing agent, composition for preventing bleed-out in...

Adhesive thermometer

Element for adhesive thermometer

Reel-to-reel inspection apparatus and inspection method using the same

Method of manufacturing multi-layer circuit board and multi-layer c...

Method of manufacturing semiconductor package substrate with limite...

Method of manufacturing lead frame

Method of manufacturing circuit board and chip package and circuit...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING CIRCUIT BOARD

METHOD FOR MANUFACTURING SUBSTRATE

METHOD OF MANUFACTURING LEAD FRAME

PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...

LEAD FRAME INCLUDING LEAD WITH GROOVE FORMED THEREIN

PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE

PRE-MOLD SUBSTRATE AND METHOD OF MANUFACTURING PRE-MOLD SUBSTRATE

SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING TH...

MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS

WIRELESS CHARGE COIL

WIRELESS CHARGE COIL

REEL-TO-REEL CIRCUIT BOARD MANUFACTURING APPARATUS

LEAD FRAME

REEL-TO-REEL COMPONENT DRYING APPARATUS

REEL-TO-REEL CIRCUIT BOARD MANUFACTURING APPARATUS

MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS AND MULTILAYER CIR...

REEL-TO-REEL SURFACE PRESS APPARATUS

WORKING TABLE FOR REEL-TO-REEL PROCESS

SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME,...

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAM...

APPARATUS FOR GRINDING SURFACE OF SUBSTRATE

SENSOR PACKAGE AND SENSOR PACKAGE MODULE INCLUDING THE SAME

COMPOSITE COIL PATTERN FOR WIRELESS CHARGING AND MAGNETIC SECURE TR...

SAW BASED OPTICAL SENSOR DEVICE AND PACKAGE INCLUDING THE SAME

METHOD OF MANUFACTURING CIRCUIT BOARD

APPARATUS FOR AND METHOD OF POLISHING SURFACE OF SUBSTRATE

METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD...

FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Trademarklast 30 trademarks