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Changwon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Pre-mold substrate and method of manufacturing pre-mold substrate
Patent number
12,249,571
Issue date
Mar 11, 2025
HAESUNG DS CO., LTD.
Kwang Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor package and sensor package module including the same
Patent number
12,104,964
Issue date
Oct 1, 2024
HAESUNG DS CO., LTD.
Jin Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer circuit board manufacturing apparatus
Patent number
12,041,731
Issue date
Jul 16, 2024
HAESUNG DS CO., LTD
Sang Min Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
Patent number
11,876,012
Issue date
Jan 16, 2024
HAESUNG DS CO., LTD.
Sung Il Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing circuit board
Patent number
11,854,830
Issue date
Dec 26, 2023
HAESUNG DS CO., LTD.
Dong Jin Yoon
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Saw based optical sensor device and package including the same
Patent number
11,674,890
Issue date
Jun 13, 2023
HAESUNG DS CO., LTD.
Jin Woo Lee
G01 - MEASURING TESTING
Information
Patent Grant
Sensor package with reduced height cavity walls and sensor package...
Patent number
11,209,323
Issue date
Dec 28, 2021
HAESUNG DS CO., LTD.
Jin Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible semiconductor package formed by roll-to-roll process
Patent number
11,139,220
Issue date
Oct 5, 2021
HAESUNG DS CO., LTD.
Jea Won Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Saw based optical sensor device and package including the same
Patent number
11,112,352
Issue date
Sep 7, 2021
HAESUNG DS CO., LTD.
Jin Woo Lee
G01 - MEASURING TESTING
Information
Patent Grant
Sensor unit, temperature sensor including the same, method of manuf...
Patent number
10,942,070
Issue date
Mar 9, 2021
HAESUNG DS CO., LTD.
Jin Woo Lee
G01 - MEASURING TESTING
Information
Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
Patent number
10,910,299
Issue date
Feb 2, 2021
HAESUNG DS CO., LTD.
In Seob Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Graphene synthesis apparatus and graphene synthesis method using th...
Patent number
10,882,748
Issue date
Jan 5, 2021
HAESUNG DS CO., LTD.
Dong Kwan Won
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor package substrate
Patent number
10,840,161
Issue date
Nov 17, 2020
HAESUNG DS CO., LTD.
In Seob Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package substrate and method for manufacturing same
Patent number
10,840,170
Issue date
Nov 17, 2020
HAESUNG DS CO., LTD.
In Seob Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
Patent number
10,811,302
Issue date
Oct 20, 2020
HAESUNG DS CO., LTD.
Sung II Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Proximity sensor having substrate including light sensing area and...
Patent number
10,749,066
Issue date
Aug 18, 2020
HAESUNG DS CO., LTD.
Jin Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temperature sensor patch and adhesive type thermometer including th...
Patent number
10,739,205
Issue date
Aug 11, 2020
HAESUNG DS CO., LTD.
Jae Hoon Jang
G01 - MEASURING TESTING
Information
Patent Grant
Graphene wire, cable employing the same, and method of manufacturin...
Patent number
10,714,231
Issue date
Jul 14, 2020
HAESUNG DS CO., LTD.
Dong Kwan Won
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package substrate and method for manufacturing same
Patent number
10,643,932
Issue date
May 5, 2020
HAESUNG DS CO., LTD.
In Seob Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leakage detection system and leakage detection method
Patent number
10,641,679
Issue date
May 5, 2020
HAESUNG DS CO., LTD.
Hyun Tae Lim
G08 - SIGNALLING
Information
Patent Grant
Semiconductor package substrate and manufacturing method therefor
Patent number
10,643,933
Issue date
May 5, 2020
HAESUNG DS CO., LTD.
In Seob Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Element for adhesive thermometer
Patent number
D842136
Issue date
Mar 5, 2019
HAESUNG DS CO., LTD.
Jae Hoon Jang
D10 - Measuring, testing, or signalling instruments
Information
Patent Grant
Bleed-out preventing agent, composition for preventing bleed-out in...
Patent number
10,196,367
Issue date
Feb 5, 2019
HAESUNG DS CO., LTD.
Soeng Ick Kim
C07 - ORGANIC CHEMISTRY
Information
Patent Grant
Adhesive thermometer
Patent number
D833305
Issue date
Nov 13, 2018
HAESUNG DS CO., LTD.
Jae Hoon Jang
D10 - Measuring, testing, or signalling instruments
Information
Patent Grant
Element for adhesive thermometer
Patent number
D833306
Issue date
Nov 13, 2018
HAESUNG DS CO., LTD.
Jae Hoon Jang
D10 - Measuring, testing, or signalling instruments
Information
Patent Grant
Reel-to-reel inspection apparatus and inspection method using the same
Patent number
9,671,352
Issue date
Jun 6, 2017
HAESUNG DS CO., LTD.
Suck-Ha Woo
G01 - MEASURING TESTING
Information
Patent Grant
Method of manufacturing multi-layer circuit board and multi-layer c...
Patent number
9,532,466
Issue date
Dec 27, 2016
HAESUNG DS CO., LTD.
Sang-min Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing semiconductor package substrate with limite...
Patent number
9,460,986
Issue date
Oct 4, 2016
HAESUNG DS CO., LTD.
Sung Il Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing lead frame
Patent number
9,299,588
Issue date
Mar 29, 2016
HAESUNG DS CO., LTD.
Jeung-Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing circuit board and chip package and circuit...
Patent number
9,257,310
Issue date
Feb 9, 2016
HAESUNG DS CO., LTD.
Sang-Min Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
Publication number
20250071909
Publication date
Feb 27, 2025
HAESUNG DS CO., LTD.
Soon-Chul KWON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING SUBSTRATE
Publication number
20250022722
Publication date
Jan 16, 2025
HAESUNG DS CO., LTD.
Jongwoo PARK
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD OF MANUFACTURING LEAD FRAME
Publication number
20250006508
Publication date
Jan 2, 2025
HAESUNG DS CO., LTD.
Gwang Ryeol PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...
Publication number
20240431035
Publication date
Dec 26, 2024
HAESUNG DS CO., LTD.
Myeong Jin HAN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LEAD FRAME INCLUDING LEAD WITH GROOVE FORMED THEREIN
Publication number
20240194571
Publication date
Jun 13, 2024
HAESUNG DS CO., LTD
Do Yeon WOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE
Publication number
20240170291
Publication date
May 23, 2024
HAESUNG DS CO., LTD.
Jong Hoe Ku
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-MOLD SUBSTRATE AND METHOD OF MANUFACTURING PRE-MOLD SUBSTRATE
Publication number
20240038652
Publication date
Feb 1, 2024
HAESUNG DS CO., LTD
Kwang Jae YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING TH...
Publication number
20230317574
Publication date
Oct 5, 2023
HAESUNG DS CO., LTD.
Suyoen SON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS
Publication number
20230114747
Publication date
Apr 13, 2023
HAESUNG DS CO., LTD.
Sang Min LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRELESS CHARGE COIL
Publication number
20230106085
Publication date
Apr 6, 2023
HAESUNG DS CO., LTD.
Sang Hak LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRELESS CHARGE COIL
Publication number
20230104216
Publication date
Apr 6, 2023
HAESUNG DS CO., LTD.
Sang Hak LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REEL-TO-REEL CIRCUIT BOARD MANUFACTURING APPARATUS
Publication number
20230101713
Publication date
Mar 30, 2023
HAESUNG DS CO., LTD.
Hyun Tae LIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LEAD FRAME
Publication number
20230102887
Publication date
Mar 30, 2023
HAESUNG DS CO., LTD.
Dong Jin YOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REEL-TO-REEL CIRCUIT BOARD MANUFACTURING APPARATUS
Publication number
20230102076
Publication date
Mar 30, 2023
HAESUNG DS CO., LTD.
Chonghan PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
REEL-TO-REEL COMPONENT DRYING APPARATUS
Publication number
20230097759
Publication date
Mar 30, 2023
HAESUNG DS CO., LTD.
Seung Seob LEE
F26 - DRYING
Information
Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS AND MULTILAYER CIR...
Publication number
20230095254
Publication date
Mar 30, 2023
HAESUNG DS CO., LTD.
Sang Min LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
REEL-TO-REEL SURFACE PRESS APPARATUS
Publication number
20230094795
Publication date
Mar 30, 2023
HAESUNG DS CO., LTD.
Yong Nam Kim
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Application
WORKING TABLE FOR REEL-TO-REEL PROCESS
Publication number
20230083630
Publication date
Mar 16, 2023
HAESUNG DS CO., LTD.
Jongwoo Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME,...
Publication number
20230080101
Publication date
Mar 16, 2023
HAESUNG DS CO., LTD.
Dong Jin YOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAM...
Publication number
20220285251
Publication date
Sep 8, 2022
HAESUNG DS CO., LTD.
Wonbin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR GRINDING SURFACE OF SUBSTRATE
Publication number
20220274223
Publication date
Sep 1, 2022
HAESUNG DS CO., LTD.
Jong Hoe Ku
B24 - GRINDING POLISHING
Information
Patent Application
SENSOR PACKAGE AND SENSOR PACKAGE MODULE INCLUDING THE SAME
Publication number
20220082454
Publication date
Mar 17, 2022
HAESUNG DS CO., LTD
Jin Woo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE COIL PATTERN FOR WIRELESS CHARGING AND MAGNETIC SECURE TR...
Publication number
20220021415
Publication date
Jan 20, 2022
HAESUNG DS CO., LTD
Ki Min LEE
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
SAW BASED OPTICAL SENSOR DEVICE AND PACKAGE INCLUDING THE SAME
Publication number
20210381952
Publication date
Dec 9, 2021
HAESUNG DS CO., LTD
Jin Woo LEE
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
Publication number
20210217629
Publication date
Jul 15, 2021
HAESUNG DS CO., LTD
Dong Jin YOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR AND METHOD OF POLISHING SURFACE OF SUBSTRATE
Publication number
20210107094
Publication date
Apr 15, 2021
HAESUNG DS CO., LTD
Sung Il KANG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD...
Publication number
20210098268
Publication date
Apr 1, 2021
HAESUNG DS CO., LTD
Dong Young PYEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210057301
Publication date
Feb 25, 2021
HAESUNG DS CO., LTD
Jea Won KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...
Publication number
20200411362
Publication date
Dec 31, 2020
HAESUNG DS CO., LTD
Sung Il KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Publication number
20200227344
Publication date
Jul 16, 2020
HAESUNG DS CO., LTD
In Seob BAE
H01 - BASIC ELECTRIC ELEMENTS
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