HANGZHOU SILAN INTEGRATED CIRCUITS CO., LTD.

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Hangzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
MEMS device and manufacturing method thereof
- Patent number 11,305,985
- Issue date Apr 19, 2022
- HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD.
- Wei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and manufacturing method thereof
- Patent number 11,212,611
- Issue date Dec 28, 2021
- HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD.
- Yongxiang Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS assembly and manufacturing method thereof
- Patent number 11,161,734
- Issue date Nov 2, 2021
- HANGZHOU SILAN INTEGRATED CIRCUITS CO., LTD.
- Yongxiang Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Isolation structure and manufacturing method thereof for high-volta...
- Patent number 10,770,340
- Issue date Sep 8, 2020
- Hangzhou Silan Integrated Circuit Co., Ltd.
- Yongxiang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple silicon trenches forming method for MEMS sealing cap wafer...
- Patent number 10,513,431
- Issue date Dec 24, 2019
- Hangzhou Silan Integrated Circuit Co., Ltd.
- Yongxiang Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dielectrically isolated semiconductor device and method for manufac...
- Patent number 10,297,662
- Issue date May 21, 2019
- Hangzhou Silan Microelectronics Co., Ltd.
- Changjun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple silicon trenches forming method for MEMS sealing cap wafer...
- Patent number 10,081,541
- Issue date Sep 25, 2018
- Hangzhou Silan Integrated Circuit Co., Ltd.
- Yongxiang Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Isolation structure and manufacturing method thereof for high-volta...
- Patent number 9,824,913
- Issue date Nov 21, 2017
- Hangzhou Silan Integrated Circuit Co., Ltd.
- Yongxiang Wen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMS MICROPHONE AND MANUFACTURING METHOD THEREOF
- Publication number 20210168497
- Publication date Jun 3, 2021
- Hangzhou Silan Integrated Circuit Co., Ltd.
- Yongxiang Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200391996
- Publication date Dec 17, 2020
- Hangzhou Silan Integrated Circuit Co., Ltd.
- Wei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20200255286
- Publication date Aug 13, 2020
- Hangzhou Silan Integrated Circuits Co.,Ltd.
- Yongxiang Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER...
- Publication number 20180362339
- Publication date Dec 20, 2018
- HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD
- Yongxiang Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF FOR HIGH-VOLTA...
- Publication number 20180033676
- Publication date Feb 1, 2018
- HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD
- Yongxiang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRICALLY ISOLATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFAC...
- Publication number 20170179227
- Publication date Jun 22, 2017
- HANGZHOU SILAN MICROELECTRONICS CO., LTD.
- Changjun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20170081176
- Publication date Mar 23, 2017
- HANGZHOU SILAN MICROELECTRONICS CO., LTD.
- Feng JI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF FOR HIGH-VOLTA...
- Publication number 20150179497
- Publication date Jun 25, 2015
- HANGZHOU SILAN MICROELECTRONICS CO., LTD.
- Yongxiang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER...
- Publication number 20150091140
- Publication date Apr 2, 2015
- HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD
- Yongxiang Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

HANGZHOU SILAN INTEGRATED CIRCUITS CO., LTD.

Organization

Patents Grantslast 30 patents

MEMS device and manufacturing method thereof

MEMS microphone and manufacturing method thereof

MEMS assembly and manufacturing method thereof

Isolation structure and manufacturing method thereof for high-volta...

Multiple silicon trenches forming method for MEMS sealing cap wafer...

Dielectrically isolated semiconductor device and method for manufac...

Multiple silicon trenches forming method for MEMS sealing cap wafer...

Isolation structure and manufacturing method thereof for high-volta...

Patents Applicationslast 30 patents

MEMS MICROPHONE AND MANUFACTURING METHOD THEREOF

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

MEMS ASSEMBLY AND MANUFACTURING METHOD THEREOF

MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER...

ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF FOR HIGH-VOLTA...

DIELECTRICALLY ISOLATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFAC...

MEMS DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF FOR HIGH-VOLTA...

MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER...

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